LCMXO1200C-4BN256C
IC FPGA 211 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA, CSPBGA
- 庫存
- 1,360 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 1.71V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO1200C-4BN256C 的主要供貨及採購資訊。
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LCMXO1200C-4BN256C 詳細描述
Product Overview
The LCMXO1200C-4BN256C is a Lattice Semiconductor Corporation MachXO FPGA for embedded logic, signal routing, and control functions. The device provides 1200 logic elements/cells, 150 LABs/CLBs, 211 I/O pins, and 9421 total RAM bits in a 256-LFBGA, CSPBGA package with a 256-CABGA (14x14) package designation. It is surface mount and operates from 1.71 V to 3.465 V supply, with a junction temperature range of 0°C to 85°C.
Key Features
- MachXO FPGA core with 1200 logic elements/cells and 150 LABs/CLBs for embedded logic implementation.
- 211 I/O pins support external device interfacing, signal routing, and control functions.
- 9421 total RAM bits provide on-chip storage for buffering or small data storage.
- Supply voltage range of 1.71 V to 3.465 V.
- Surface mount 256-LFBGA, CSPBGA package with 256-CABGA (14x14) package designation.
- Operating junction temperature range of 0°C to 85°C.
Applications
- Embedded control logic and state machine implementation
- I/O expansion and pin mapping for board-level interfaces
- Sensor or actuator interface aggregation and digital routing
- Protocol bridging or glue logic between digital subsystems
Design & Procurement Notes
Design and procurement considerations should focus on the fixed resource set and package constraints. The 1200 logic elements/cells, 150 LABs/CLBs, 9421 RAM bits, and 211 I/O pins define the available logic, memory, and pin resources for a design. The 1.71 V to 3.465 V supply range and 0°C to 85°C junction temperature range should be reflected in power sequencing, decoupling, and thermal design. The 256-LFBGA, CSPBGA package with a 256-CABGA (14x14) package designation requires a matching surface-mount land pattern, solder paste stencil, and inspection method.
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