MC34PF4210A3ES
PF4210
- Manufacturer
- NXP USA Inc.
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 56-VFQFN Exposed Pad
- Stock
- 1,461 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | NXP USA Inc. |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Audio, Video |
| Min Qty | 260 |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Package | Tray |
| Product status | Active |
| Supplier Device Package | 56-QFN-EP (8x8) |
| Voltage - Supply | 2.8V ~ 4.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MC34PF4210A3ES.
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Detailed Description for MC34PF4210A3ES
Product Overview
The MC34PF4210A3ES from NXP USA Inc. is a PF4210 audio and video power management IC for compact surface-mount designs. It operates from a 2.8 V to 4.5 V supply and is specified for an ambient temperature range of -40°C to 105°C (TA). The device uses a 56-VFQFN exposed pad package, identified as 56-QFN-EP (8x8), with surface mount, wettable flank mounting. This package and supply range support integration into systems where power management functions are needed for audio and video subsystems while maintaining a small board-level footprint.
Key Features
- MC34PF4210A3ES is the manufacturer part number from NXP USA Inc.
- PF4210 is designated as an audio and video power management IC.
- Supply voltage range is 2.8 V to 4.5 V.
- Operating temperature range is -40°C to 105°C (TA).
- Package/case is 56-VFQFN exposed pad.
- Device package is 56-QFN-EP (8x8).
- Mounting type is surface mount, wettable flank.
Applications
- Power management in audio subsystems
- Power management in video subsystems
Design & Procurement Notes
For design planning, confirm that the system supply rail falls within 2.8 V to 4.5 V and that the expected ambient environment remains within -40°C to 105°C (TA). The 56-QFN-EP (8x8) package requires a compatible surface-mount land pattern and exposed pad handling during PCB layout. The wettable flank mounting style should be considered during assembly planning and inspection compatibility checks. Board designers should verify that the 8x8 package footprint is compatible with the available PCB area and component clearance. The supply range and temperature range should be checked against the final system power architecture and environmental profile. Because the device is specified for audio and video power management functions, it fits designs that require these subsystem-level power management roles within the stated electrical and mechanical constraints.
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