MC34PF3001A4EPR2
POWER MANAGEMENT IC I.MX7 PRE-
- Manufacturer
- NXP USA Inc.
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 48-VFQFN Exposed Pad
- Stock
- 1,471 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | NXP USA Inc. |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Processor |
| Min Qty | 4000 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 105°C |
| Package | Tape & Reel (TR) |
| Product status | Active |
| Supplier Device Package | 48-HVQFN (7x7) |
| Voltage - Supply | 2.8V ~ 5.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MC34PF3001A4EPR2.
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Detailed Description for MC34PF3001A4EPR2
Product Overview
The MC34PF3001A4EPR2 from NXP USA Inc. is a specialized power management integrated circuit intended for use with I.MX7 processor systems. It is a surface-mount PMIC in a 48-VFQFN exposed-pad package, 48-HVQFN (7x7). The device operates from a 2.8V to 5.5V supply and supports an operating temperature range of -40°C to 105°C. This power management IC for IMX7 includes three buck regulators, six LDOs, and an always-on function for processor-centric embedded designs that require multiple regulated outputs.
Key Features
- Intended for processor applications.
- Supports a 2.8V to 5.5V supply input.
- Operates over -40°C to 105°C.
- Surface-mount 48-VFQFN exposed-pad package, 48-HVQFN (7x7).
- Includes three buck regulators, six LDOs, and an always-on function.
Applications
- Powering application processors in embedded systems that use I.MX7-based platforms.
- Generating multiple regulated rails for processor-centric control boards.
- Maintaining always-on power for processor system functions.
Design & Procurement Notes
For board design, the 2.8V to 5.5V supply range and -40°C to 105°C operating temperature define the electrical and thermal envelope for placement near the associated processor. The three buck regulators, six LDOs, and always-on function indicate a multi-rail architecture that may need to be partitioned according to processor requirements, although exact output assignments should be confirmed during design. The 48-VFQFN exposed-pad package requires a surface-mount layout with adequate thermal pad connection, and the 48-HVQFN (7x7) package dimension should be reflected in the land pattern and keepout planning. Because the component is intended for processor applications, layout, decoupling, and thermal management should be considered alongside the selected I.MX7 platform.
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