PART NUMBER

MC34709VK

IC PWR MGMT IMX50/53 130MAPBGA

Manufacturer
NXP USA Inc.
Package
130-LFBGA
Stock
1,720 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer NXP USA Inc.
Product Category Specialized Power Management ICs (PMICs)
Applications Processor
Current - Supply 370µA
Min Qty 1
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package Tray
Product status Active
Supplier Device Package 130-MAPBGA (8x8)
Voltage - Supply 3V ~ 4.5V
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for MC34709VK.

Check Price & Availability
Part Number MC34709VK
Availability 1,720 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for MC34709VK

Product Overview

The NXP USA Inc. MC34709VK is a specialized power management integrated circuit for processor applications, including IMX50/53 contexts. It is a processor PMIC housed in a 130-LFBGA package, with a 130-MAPBGA (8x8) device package. The device is surface mount and operates from a 3 V to 4.5 V supply, with a 370 µA supply current. Its rated operating temperature range is -40°C to 85°C. It is intended for compact processor-centric embedded designs that require a dedicated power management IC in a ball-grid array footprint.

Key Features

  • Specialized processor power management IC for processor applications
  • 130-LFBGA package with 130-MAPBGA (8x8) device package
  • Surface-mount construction
  • 3 V to 4.5 V supply voltage range
  • 370 µA supply current
  • -40°C to 85°C operating temperature range

Applications

  • Processor power management subsystems in embedded designs
  • Application processor boards requiring a dedicated PMIC in a compact BGA footprint
  • Processor-based hardware platforms operating within a 3 V to 4.5 V supply range

Design & Procurement Notes

Board designers should plan the layout for the 130-LFBGA, 130-MAPBGA (8x8) surface-mount package and account for the associated land pattern and routing constraints. The 3 V to 4.5 V supply range and 370 µA supply current should be checked against the processor platform's power rail and budget assumptions. The -40°C to 85°C operating temperature range should be considered during thermal and environmental design. For procurement, use the exact NXP USA Inc. part number MC34709VK and confirm the package form factor to ensure board-level compatibility.

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