MC34704AEP
IC POWER MANAGEMENT 56-QFN
Quick Answer: MC34704AEP is a power management integrated circuit from NXP USA Inc.
- Manufacturer
- NXP USA Inc.
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 56-VFQFN Exposed Pad
- Stock
- 2,460 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | NXP USA Inc. |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Processor |
| Current - Supply | 86mA |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -20°C ~ 85°C |
| Package | Tray |
| Product status | Active |
| Supplier Device Package | 56-QFN-EP (7x7) |
| Voltage - Supply | 2.7V ~ 5.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MC34704AEP.
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Detailed Description for MC34704AEP
Product Overview
MC34704AEP is a power management integrated circuit from NXP USA Inc. intended for processor applications. The device is supplied as a surface-mount 56-VFQFN exposed-pad package, with a package of 56-QFN-EP measuring 7 mm by 7 mm. It operates from a supply voltage range of 2.7 V to 5.5 V and has a specified supply current of 86 mA. The operating temperature range is -20°C to 85°C. This IC is suitable for compact board designs that require a processor power management component in a 56-pin QFN footprint.
Key Features
- Processor-focused power management IC from NXP USA Inc.
- Supply voltage range: 2.7 V to 5.5 V
- Supply current: 86 mA
- Operating temperature range: -20°C to 85°C
- Surface-mount 56-VFQFN exposed-pad package, 56-QFN-EP (7x7)
Applications
- Embedded computing platforms with processor power management requirements
- Application processor power management in compact board designs
- Processor subsystems operating from 2.7 V to 5.5 V supply
Design & Procurement Notes
When selecting MC34704AEP, verify that the system supply falls within 2.7 V to 5.5 V and that the operating environment remains within -20°C to 85°C. Include the 86 mA supply current in overall power budget calculations. Because the device uses a surface-mount 56-VFQFN exposed-pad package, the PCB land pattern, solder paste design, and assembly process must match the 56-QFN-EP (7x7) footprint. Use the exact manufacturer part number and package when checking design files, layout, and procurement records during component selection.
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