MPF200TL-FCSG325I

Product Overview

The MPF200TL-FCSG325I from Microchip Technology is a PolarFire field programmable gate array in a 325-LFBGA, FC surface-mount package. The package designation is 325-FCBGA (11x14.5). The device includes 192000 logic elements/cells, 13619200 total RAM bits, and 170 I/O pins, with a 0.97V to 1.08V supply voltage range and an operating junction temperature range of -40°C to 100°C. Its programmable logic and memory resources support configurable digital systems that require flexible interconnection and on-chip storage within a single surface-mount component.

Key Features

• 192000 logic elements/cells for configurable digital logic
• 13619200 total RAM bits for on-chip data storage
• 170 I/O pins for external digital connectivity
• 0.97V to 1.08V supply voltage range
• Surface-mount 325-LFBGA, FC package, 325-FCBGA (11x14.5)
• -40°C to 100°C operating junction temperature
• PolarFire FPGA device from Microchip Technology

Applications

• embedded control systems using configurable digital logic
• data aggregation or preprocessing equipment with multiple digital interfaces
• programmable digital systems requiring flexible interconnection and on-chip storage

Design & Procurement Notes

Design and procurement planning should account for the 0.97V to 1.08V supply range, the -40°C to 100°C junction temperature limit, and the 325-LFBGA, FC surface-mount package, including the 325-FCBGA (11x14.5) footprint. Logic, memory, and I/O planning should be based on the available 192000 logic elements/cells, 13619200 total RAM bits, and 170 I/O pins. Thermal management and board layout should be considered for the operating junction temperature and surface-mount package. Designers should verify power delivery, thermal paths, and PCB land pattern compatibility against the voltage, junction temperature, and package dimensions.