MPF200TL-FCG484E
IC FPGA 244 I/O 484FBGA
Quick Answer: The MPF200TL-FCG484E from Microchip Technology is a PolarFire™ FPGA in a 484-BFBGA package, with a 484-FPBGA (19x19) device package and surface-mount mounting.
- Manufacturer
- Microchip Technology
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 484-BFBGA
- Stock
- 1,297 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Microchip Technology |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | PolarFire™ |
| Supplier Device Package | 484-FPBGA (19x19) |
| Voltage - Supply | 0.97V ~ 1.08V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MPF200TL-FCG484E.
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Detailed Description for MPF200TL-FCG484E
Product Overview
The MPF200TL-FCG484E from Microchip Technology is a PolarFire™ FPGA in a 484-BFBGA package, with a 484-FPBGA (19x19) device package and surface-mount mounting. The device provides 244 I/O, 192,000 logic elements/cells, and 13,619,200 total RAM bits. Its supply voltage range is 0.97V ~ 1.08V, and its operating temperature range is 0°C ~ 100°C (TJ). The device is categorized as an embedded FPGA, which supports configurable logic functions in board-level designs.
Key Features
- PolarFire™ FPGA from Microchip Technology
- 192,000 logic elements/cells
- 13,619,200 total RAM bits
- 244 I/O
- Supply voltage range of 0.97V ~ 1.08V
- Surface-mount 484-BFBGA package with 484-FPBGA (19x19) device package
- Operating temperature range of 0°C ~ 100°C (TJ)
Applications
- Embedded control and processing subsystems that require configurable digital logic and flexible I/O connectivity.
- Board-level designs that use on-chip RAM bits and logic resources for custom buffering, state machines, or I/O interfacing.
- Programmable hardware implementations where the 244 I/O and FPGA logic resources can be allocated to user-defined digital functions.
Design & Procurement Notes
For design and procurement planning, confirm that the PCB assembly process supports the 484-FPBGA (19x19) surface-mount package and that the board layout provides access to the 244 I/O connections. Consider the 484-BFBGA case designation when reviewing package documentation and assembly land patterns. Power delivery should be planned around the 0.97V ~ 1.08V supply range, while thermal design should keep the junction temperature within 0°C ~ 100°C. The 192,000 logic elements/cells and 13,619,200 total RAM bits define the programmable resource budget for logic, buffering, and interface routing.
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