MPF200TL-FCG484I
IC FPGA 244 I/O 484FBGA
Quick Answer: The MPF200TL-FCG484I from Microchip Technology is a PolarFire-series FPGA integrated circuit in a 484-BFBGA package.
- Manufacturer
- Microchip Technology
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 484-BFBGA
- Stock
- 1,332 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Microchip Technology |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | PolarFire™ |
| Supplier Device Package | 484-FPBGA (19x19) |
| Voltage - Supply | 0.97V ~ 1.08V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MPF200TL-FCG484I.
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Detailed Description for MPF200TL-FCG484I
Product Overview
The MPF200TL-FCG484I from Microchip Technology is a PolarFire-series FPGA integrated circuit in a 484-BFBGA package. It provides 192000 logic elements/cells, 13619200 total RAM bits, and 244 I/O. The device is intended for surface-mount assembly and operates over a junction temperature range of -40°C to 100°C. Its supply voltage range is 0.97 V to 1.08 V. The 484-FPBGA (19x19) device package supports embedded logic implementations where logic capacity, memory resources, and external interface count are important.
Key Features
- PolarFire-series FPGA integrated circuit
- 192000 logic elements/cells
- 13619200 total RAM bits
- 244 I/O
- 0.97 V to 1.08 V supply voltage range
- -40°C to 100°C (TJ) operating temperature range
- 484-BFBGA package with 484-FPBGA (19x19) device package
- Surface-mount assembly
Applications
- Embedded control logic in systems requiring custom peripheral interfacing
- Hardware acceleration of data-path processing
- Protocol bridging and interface translation between digital subsystems
- Reconfigurable logic in test and measurement systems
Design & Procurement Notes
When selecting the MPF200TL-FCG484I, verify that the system power architecture can provide the 0.97 V to 1.08 V supply range and that the board layout supports the 484-BFBGA package and the 484-FPBGA (19x19) device package. The 244 I/O count should be mapped against required external interfaces, while the 192000 logic elements/cells and 13619200 total RAM bits provide the basis for estimating logic and memory utilization. Thermal design should account for the -40°C to 100°C (TJ) operating temperature range. Because the device is an FPGA, logic and I/O resource planning should be completed during schematic and PCB layout to avoid package or interface conflicts.
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