EFP0104GM20-E

Product Overview

The Silicon Labs EFP0104GM20-E is a power management integrated circuit from the EFP01 series, described as a wired buck with LDO PMIC. It is supplied in a 20-QFN (3x3) surface-mount package with an exposed pad and is specified for an automotive grade. The device operates from a 1.8 V to 5.5 V supply and has a specified supply current of 24 nA. Its junction temperature operating range is -40°C to 100°C, making it suitable for embedded power rails in compact board designs.

Key Features

• Integrates a wired buck converter with an LDO in a power management IC.
• Operates from a 1.8 V to 5.5 V supply.
• Specified supply current: 24 nA.
• Automotive grade.
• Surface-mount 20-VFQFN exposed pad package in 20-QFN (3x3).
• Operating junction temperature range: -40°C to 100°C (TJ).

Applications

• Embedded systems that require regulated rails from a 1.8 V to 5.5 V supply.
• Automotive electronic modules needing a compact buck-plus-LDO power management function.
• Surface-mount designs using a 20-QFN (3x3) package with an exposed pad.

Design & Procurement Notes

For design, the EFP0104GM20-E should be evaluated against the 1.8 V to 5.5 V input range and the 24 nA supply current specification. The automotive grade and -40°C to 100°C junction temperature range are relevant for thermal and qualification planning. The 20-VFQFN exposed pad package requires attention to pad layout, soldering, and heat transfer, while the 20-QFN (3x3) footprint supports surface-mount assembly in compact power sections.