料號

LFE2M100E-5FN1152C

IC FPGA 520 I/O 1152FBGA

封裝
1152-BBGA
庫存
1,433 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package Tray
Product status Not For New Designs
Series ECP2M
Supplier Device Package 1152-FPBGA (35x35)
Voltage - Supply 1.14V ~ 1.26V
資料表 查看資料表PDF
採購資訊

採購概覽

LFE2M100E-5FN1152C 的主要供貨及採購資訊。

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料號 LFE2M100E-5FN1152C
供貨狀態 列示庫存 1,433 pcs 當前數量需確認。
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LFE2M100E-5FN1152C 詳細描述

Product Overview

The LFE2M100E-5FN1152C from Lattice Semiconductor Corporation is an ECP2M field programmable gate array supplied in a 1152-FPBGA (35x35) surface-mount package, also described as 1152-BBGA. The device provides 520 I/O, 95,000 logic elements or cells, 11,875 LABs or CLBs, and 5,435,392 total RAM bits. Its specified supply voltage range is 1.14 V to 1.26 V, and the maximum junction temperature rating is 85 °C, with a minimum operating junction temperature of 0 °C. These parameters support board-level FPGA integration in systems that require programmable logic, distributed on-chip memory, and a high I/O count in a fine-pitch BGA footprint.

Key Features

  • 520 I/O for system connectivity and programmable logic interfacing
  • 95,000 logic elements or cells for configurable digital logic
  • 11,875 LABs or CLBs for fabric resource planning
  • 5,435,392 total RAM bits for on-chip buffering and lookup structures
  • 1.14 V to 1.26 V supply voltage range
  • Surface-mount 1152-FPBGA (35x35) package, described as 1152-BBGA
  • Operating junction temperature range of 0 °C to 85 °C
  • ECP2M FPGA architecture from Lattice Semiconductor Corporation

Applications

  • Programmable logic control in embedded system boards
  • High-I/O interface aggregation for custom digital subsystems
  • On-chip buffering and lookup tables in configurable datapaths
  • Surface-mount FPGA integration in 35 mm by 35 mm BGA board layouts

Design & Procurement Notes

Design planning should account for the 1152-FPBGA (35x35) surface-mount footprint, 520 I/O, and the 1.14 V to 1.26 V supply range when defining power delivery, pin assignment, and PCB fan-out. The 95,000 logic elements or cells, 11,875 LABs or CLBs, and 5,435,392 total RAM bits provide the fabric and memory resources needed to size a configuration before layout. The 0 °C to 85 °C junction temperature rating should be used with thermal analysis for the selected board environment. Procurement notes should retain the exact manufacturer part number, LFE2M100E-5FN1152C, because package and device package descriptions include 1152-BBGA and 1152-FPBGA (35x35).

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