LFE2M35SE-6FN672I
IC FPGA 410 I/O 672FPBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 672-BBGA
- 庫存
- 1,499 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ECP2M |
| Supplier Device Package | 672-FPBGA (27x27) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
LFE2M35SE-6FN672I 的主要供貨及採購資訊。
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LFE2M35SE-6FN672I 詳細描述
Product Overview
The LFE2M35SE-6FN672I is a field-programmable gate array from Lattice Semiconductor Corporation, part of the ECP2M series. It is a surface-mount device in a 672-BBGA package, with a 672-FPBGA (27x27) footprint. The device provides 410 I/O, 34000 logic elements or cells, 4250 LABs or CLBs, and 2151424 total RAM bits. The specified supply voltage range is 1.14 V to 1.26 V, and the operating temperature range is -40 °C to 100 °C (TJ).
Key Features
- Field-programmable gate array in the ECP2M series with 34000 logic elements or cells.
- Provides 4250 LABs or CLBs and 2151424 total RAM bits for programmable logic and embedded memory structures.
- Offers 410 I/O to support external connectivity in a 672-BBGA package.
- Specified supply voltage range of 1.14 V to 1.26 V.
- Surface-mount device with an operating temperature range of -40 °C to 100 °C (TJ).
Applications
- Embedded systems requiring configurable digital logic and I/O expansion.
- Programmable control paths where logic functions are implemented in hardware.
- Data processing and interface bridging between external peripherals and internal logic.
- Communication subsystems that use programmable logic to format, route, or process signals.
Design & Procurement Notes
When selecting this FPGA, confirm that the PCB footprint matches the 672-FPBGA (27x27) surface-mount package and that the power supply can maintain 1.14 V to 1.26 V during operation. The 410 I/O count should be compared with the board-level interface requirements, while the 34000 logic elements or cells, 4250 LABs or CLBs, and 2151424 total RAM bits provide the available logic and memory resources for the design. The -40 °C to 100 °C (TJ) operating range should be considered with thermal design, especially when the package is mounted on an embedded board.
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