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PART NUMBER

MT48LC16M16A2P-6A IT:G TR

IC DRAM 256MBIT PAR 54TSOP II

Manufacturer
Micron Technology Inc.
Product Category
Memory ICs
Package
54-TSOP (0.400", 10.16mm Width)
Stock
3,123 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer Micron Technology Inc.
Product Category Memory ICs
Access Time 5.4 ns
Clock Frequency 167 MHz
Memory Format DRAM
Memory Interface Parallel
Memory Organization 16M x 16
Memory Size 256Mbit
Memory Type Volatile
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Package Tape & Reel (TR),Cut Tape (CT)
Product status Active
Supplier Device Package 54-TSOP II
Technology SDRAM
Voltage - Supply 3V ~ 3.6V
Write Cycle Time - Word, Page 12ns
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for MT48LC16M16A2P-6A IT:G TR.

Check Price & Availability
Part Number MT48LC16M16A2P-6A IT:G TR
Availability 3,123 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for MT48LC16M16A2P-6A IT:G TR

Product Overview

The MT48LC16M16A2P-6A IT:G TR from Micron Technology Inc. is a volatile DRAM memory IC using SDRAM technology. It provides 256Mbit capacity organized as 16M x 16 and uses a parallel interface with a 167 MHz clock. The device is supplied in a 54-TSOP II surface-mount package and operates from a 3V to 3.6V supply. Access time is specified as 5.4 ns, with a word/page write cycle time of 12 ns, supporting synchronous memory subsystems in systems that require parallel DRAM connectivity.

Key Features

  • 256Mbit volatile DRAM memory capacity
  • SDRAM technology with parallel memory interface
  • Memory organization of 16M x 16
  • 167 MHz clock frequency
  • 5.4 ns access time and 12 ns word/page write cycle time
  • 3V to 3.6V supply voltage range
  • 54-TSOP II surface-mount package
  • Operating temperature range of -40°C to 85°C (TA)

Applications

  • Embedded processing boards that use parallel SDRAM as volatile main memory
  • Data acquisition or instrumentation systems that buffer measurements in DRAM
  • Synchronous memory subsystems operating within the 3V to 3.6V supply range

Design & Procurement Notes

Design considerations should align the system memory architecture with the 16M x 16 organization and the parallel interface requirements. The 3V to 3.6V supply range should be considered during power delivery planning, while the -40°C to 85°C operating range should be considered during thermal layout. The 54-TSOP II surface-mount package requires appropriate PCB footprint and assembly provisions. Timing closure should account for the 167 MHz clock, 5.4 ns access time, and 12 ns word/page write cycle time.

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