MT48LC16M16A2P-6A IT:G TR
IC DRAM 256MBIT PAR 54TSOP II
- Manufacturer
- Micron Technology Inc.
- Product Category
- Memory ICs
- Package
- 54-TSOP (0.400", 10.16mm Width)
- Stock
- 3,123 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Micron Technology Inc. |
|---|---|
| Product Category | Memory ICs |
| Access Time | 5.4 ns |
| Clock Frequency | 167 MHz |
| Memory Format | DRAM |
| Memory Interface | Parallel |
| Memory Organization | 16M x 16 |
| Memory Size | 256Mbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 54-TSOP II |
| Technology | SDRAM |
| Voltage - Supply | 3V ~ 3.6V |
| Write Cycle Time - Word, Page | 12ns |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MT48LC16M16A2P-6A IT:G TR.
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Detailed Description for MT48LC16M16A2P-6A IT:G TR
Product Overview
The MT48LC16M16A2P-6A IT:G TR from Micron Technology Inc. is a volatile DRAM memory IC using SDRAM technology. It provides 256Mbit capacity organized as 16M x 16 and uses a parallel interface with a 167 MHz clock. The device is supplied in a 54-TSOP II surface-mount package and operates from a 3V to 3.6V supply. Access time is specified as 5.4 ns, with a word/page write cycle time of 12 ns, supporting synchronous memory subsystems in systems that require parallel DRAM connectivity.
Key Features
- 256Mbit volatile DRAM memory capacity
- SDRAM technology with parallel memory interface
- Memory organization of 16M x 16
- 167 MHz clock frequency
- 5.4 ns access time and 12 ns word/page write cycle time
- 3V to 3.6V supply voltage range
- 54-TSOP II surface-mount package
- Operating temperature range of -40°C to 85°C (TA)
Applications
- Embedded processing boards that use parallel SDRAM as volatile main memory
- Data acquisition or instrumentation systems that buffer measurements in DRAM
- Synchronous memory subsystems operating within the 3V to 3.6V supply range
Design & Procurement Notes
Design considerations should align the system memory architecture with the 16M x 16 organization and the parallel interface requirements. The 3V to 3.6V supply range should be considered during power delivery planning, while the -40°C to 85°C operating range should be considered during thermal layout. The 54-TSOP II surface-mount package requires appropriate PCB footprint and assembly provisions. Timing closure should account for the 167 MHz clock, 5.4 ns access time, and 12 ns word/page write cycle time.
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