MT48LC16M16A2P-6A:G TR
IC DRAM 256MBIT PAR 54TSOP II
- Manufacturer
- Micron Technology Inc.
- Product Category
- Memory ICs
- Package
- 54-TSOP (0.400", 10.16mm Width)
- Stock
- 4,776 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Micron Technology Inc. |
|---|---|
| Product Category | Memory ICs |
| Access Time | 5.4 ns |
| Clock Frequency | 167 MHz |
| Memory Format | DRAM |
| Memory Interface | Parallel |
| Memory Organization | 16M x 16 |
| Memory Size | 256Mbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 54-TSOP II |
| Technology | SDRAM |
| Voltage - Supply | 3V ~ 3.6V |
| Write Cycle Time - Word, Page | 12ns |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MT48LC16M16A2P-6A:G TR.
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Detailed Description for MT48LC16M16A2P-6A:G TR
Product Overview
The MT48LC16M16A2P-6A:G TR is a Micron Technology Inc. SDRAM memory IC that provides 256Mbit of volatile parallel DRAM in a 54-TSOP II surface-mount package. The device is organized as 16M x 16 and operates from a 3V ~ 3.6V supply, making it suitable for board-level memory functions in systems that use a parallel memory interface. Its 167 MHz clock frequency, 5.4 ns access time, and 12 ns word/page write cycle time define the timing envelope for memory controller design. The 54-TSOP II package has a 0.400" (10.16mm) width, and the specified operating temperature range is 0°C ~ 70°C (TA).
Key Features
- 256Mbit volatile DRAM memory implemented as SDRAM technology
- 16M x 16 memory organization for parallel data access
- 167 MHz clock frequency with 5.4 ns access time
- 12 ns word and page write cycle time
- 3V ~ 3.6V supply voltage range
- 0°C ~ 70°C (TA) operating temperature range
- 54-TSOP II surface-mount package with 0.400" (10.16mm) width
Applications
- Embedded computing systems that require a volatile parallel memory device for temporary data handling
- Consumer electronics boards using a 3V ~ 3.6V SDRAM memory bus
- Processor or controller platforms needing a 16M x 16 DRAM configuration in a surface-mount package
Design & Procurement Notes
For design integration, verify that the host memory controller can support the 167 MHz clock, 5.4 ns access time, and 12 ns word/page write cycle time while maintaining the 3V ~ 3.6V supply range. The 16M x 16 organization and parallel interface should match the intended address and data bus mapping. The 54-TSOP II surface-mount package requires a compatible PCB footprint and thermal allowance for the 0°C ~ 70°C (TA) operating range. Because the device is volatile DRAM, system power sequencing and memory configuration should be reviewed as part of the board design.
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