TPS6590376ZWSR
IC PWR MGMT FOR PROCESSORS
- 產品分類
- 專用電源管理IC（PMIC）
- 封裝
- 169-LFBGA
- 庫存
- 3,039 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Texas Instruments |
|---|---|
| 產品分類 | 專用電源管理IC（PMIC） |
| Applications | Processor |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Not For New Designs |
| Supplier Device Package | 169-NFBGA (12x12) |
| Voltage - Supply | 3.135 ~ 5.25V |
| 資料表 | 查看資料表PDF |
採購概覽
TPS6590376ZWSR 的主要供貨及採購資訊。
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TPS6590376ZWSR 詳細描述
Product Overview
TPS6590376ZWSR from Texas Instruments is a processor power management integrated circuit intended for processor-centric system designs. The device is offered in a 169-LFBGA package, with a 169-NFBGA (12x12) device package, and uses surface-mount assembly. Its supply range is specified as 3.135 V to 5.25 V, and its operating temperature range is -40°C to 85°C. These characteristics define the basic electrical and mechanical envelope for integrating the IC into processor power subsystems. The manufacturer part number TPS6590376ZWSR identifies this Texas Instruments processor PMIC package variant.
Key Features
- Processor power management integrated circuit intended for processor-based systems.
- Supply voltage range: 3.135 V to 5.25 V.
- Operating temperature range: -40°C to 85°C.
- Surface-mount device in a 169-LFBGA package.
- 169-NFBGA (12x12) device package form.
- Manufacturer part number: TPS6590376ZWSR.
Applications
- Power management for processors in embedded computing boards.
- Power management for processors in application-specific computing platforms.
Design & Procurement Notes
When selecting TPS6590376ZWSR, verify that the processor power subsystem supply remains within the specified 3.135 V to 5.25 V range and that the intended operating environment is compatible with the -40°C to 85°C operating temperature range. The 169-LFBGA package and 169-NFBGA (12x12) device package form should be considered during PCB layout, pad design, solder paste planning, and assembly review because the device is surface-mount. Confirm that the selected PCB footprint matches the 169-LFBGA and 169-NFBGA (12x12) package data. Because the device is a specialized processor PMIC, integration should focus on processor power requirements and system-level voltage conditions.
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