TPS65000RTER
IC CONV STP-DWN 2.25MHZ DL 16QFN
- 產品分類
- 專用電源管理IC(PMIC)
- 封裝
- 16-WFQFN Exposed Pad
- 庫存
- 5,521 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Texas Instruments |
|---|---|
| 產品分類 | 專用電源管理IC(PMIC) |
| Applications | Handheld/Mobile Devices |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 16-WQFN (3x3) |
| Voltage - Supply | 2.3V ~ 6V |
| 資料表 | 查看資料表PDF |
採購概覽
TPS65000RTER 的主要供貨及採購資訊。
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TPS65000RTER 詳細描述
Product Overview
The TPS65000RTER from Texas Instruments is a power management integrated circuit for handheld and mobile devices. It uses a 16-WQFN (3x3) package with an exposed pad and surface-mount construction. The device accepts a supply voltage from 2.3 V to 6 V and is specified for operation from -40°C to 85°C. The device includes a step-down converter function and a 2.25 MHz frequency, making it relevant to compact power-supply designs where the package footprint and 2.25 MHz frequency need to be coordinated with the surrounding board layout.
Key Features
- Power management integrated circuit for handheld and mobile devices
- 16-WQFN (3x3) surface-mount package with exposed pad
- Supply voltage range of 2.3 V to 6 V
- Operating temperature range of -40°C to 85°C
- Step-down converter function with a 2.25 MHz frequency
Applications
- Handheld devices
- Mobile devices
Design & Procurement Notes
For design use, the 2.3 V to 6 V supply range and -40°C to 85°C operating range should be checked against the system input and ambient conditions. The 16-WQFN (3x3) exposed-pad package requires surface-mount assembly and attention to pad layout, soldering, and thermal connection. The 2.25 MHz frequency should be considered during layout, component placement, and evaluation of nearby signal paths. The surface-mount package and exposed pad require attention to assembly and inspection. For handheld and mobile contexts, compact power delivery and board-space constraints are practical factors when selecting supporting components within the final assembly.
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