TPS65000RTER
IC CONV STP-DWN 2.25MHZ DL 16QFN
Quick Answer: The TPS65000RTER from Texas Instruments is a power management integrated circuit for handheld and mobile devices.
- Manufacturer
- Texas Instruments
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 16-WFQFN Exposed Pad
- Stock
- 5,521 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Texas Instruments |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Handheld/Mobile Devices |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 16-WQFN (3x3) |
| Voltage - Supply | 2.3V ~ 6V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
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Detailed Description for TPS65000RTER
Product Overview
The TPS65000RTER from Texas Instruments is a power management integrated circuit for handheld and mobile devices. It uses a 16-WQFN (3x3) package with an exposed pad and surface-mount construction. The device accepts a supply voltage from 2.3 V to 6 V and is specified for operation from -40°C to 85°C. The device includes a step-down converter function and a 2.25 MHz frequency, making it relevant to compact power-supply designs where the package footprint and 2.25 MHz frequency need to be coordinated with the surrounding board layout.
Key Features
- Power management integrated circuit for handheld and mobile devices
- 16-WQFN (3x3) surface-mount package with exposed pad
- Supply voltage range of 2.3 V to 6 V
- Operating temperature range of -40°C to 85°C
- Step-down converter function with a 2.25 MHz frequency
Applications
- Handheld devices
- Mobile devices
Design & Procurement Notes
For design use, the 2.3 V to 6 V supply range and -40°C to 85°C operating range should be checked against the system input and ambient conditions. The 16-WQFN (3x3) exposed-pad package requires surface-mount assembly and attention to pad layout, soldering, and thermal connection. The 2.25 MHz frequency should be considered during layout, component placement, and evaluation of nearby signal paths. The surface-mount package and exposed pad require attention to assembly and inspection. For handheld and mobile contexts, compact power delivery and board-space constraints are practical factors when selecting supporting components within the final assembly.
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