料號

MPF5200AMBA1ES

POWER MANAGEMENT IC, PRE-PROG, 3

製造商
NXP USA Inc.
封裝
32-PowerWFQFN
庫存
1,468 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 NXP USA Inc.
產品分類 專用電源管理IC(PMIC)
Current - Supply 40µA
Grade Automotive
Min Qty 490
Mounting Type Surface Mount, Wettable Flank
Operating Temperature -40°C ~ 125°C
Package Tray
Product status Active
Supplier Device Package 32-HWQFN (5x5)
Voltage - Supply 2.7V ~ 5.5V
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採購資訊

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MPF5200AMBA1ES 的主要供貨及採購資訊。

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料號 MPF5200AMBA1ES
供貨狀態 列示庫存 1,468 pcs 當前數量需確認。
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MPF5200AMBA1ES 詳細描述

Product Overview

The MPF5200AMBA1ES from NXP USA Inc. is an automotive power management integrated circuit intended for specialized power management tasks. The device is described as ASIL B and provides two low-voltage buck outputs, supporting compact board-level power management in surface-mount designs. It operates from a 2.7 V to 5.5 V supply range, draws 40 µA supply current, and is rated for an operating temperature range of -40°C to 125°C. The component uses a 32-PowerWFQFN package, with a 32-HWQFN (5x5) device package and wettable flank surface-mount construction.

Key Features

  • Automotive-grade power management IC described as ASIL B.
  • Provides two low-voltage buck outputs for compact power management designs.
  • Operates from 2.7 V to 5.5 V and draws 40 µA supply current.
  • Rated for an operating temperature range of -40°C to 125°C.
  • Uses a 32-PowerWFQFN package with 32-HWQFN (5x5) device package and wettable flank mounting.

Applications

  • Automotive electronic control units requiring compact surface-mount power management.
  • Vehicle subsystems that need two low-voltage buck outputs within a 32-HWQFN (5x5) package.
  • Safety-oriented automotive power domains where ASIL B is relevant.

Design & Procurement Notes

When selecting the MPF5200AMBA1ES, designers should confirm that the system supply remains within 2.7 V to 5.5 V and that the 40 µA supply current is compatible with the power budget. The -40°C to 125°C operating range supports automotive temperature conditions, but board thermal paths, airflow, and nearby heat sources still require validation. The 32-HWQFN (5x5) package and wettable flank construction call for a compact surface-mount layout, controlled pad geometry, and inspection access for solder joints. Because the device is described as an ASIL B power management IC with two low-voltage buck outputs, system-level safety analysis and output requirements should be checked against the final architecture rather than inferred from the part number alone.

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