MPF5200AMBA1ES
POWER MANAGEMENT IC, PRE-PROG, 3
- 製造商
- NXP USA Inc.
- 產品分類
- 專用電源管理IC(PMIC)
- 封裝
- 32-PowerWFQFN
- 庫存
- 1,468 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | NXP USA Inc. |
|---|---|
| 產品分類 | 專用電源管理IC(PMIC) |
| Current - Supply | 40µA |
| Grade | Automotive |
| Min Qty | 490 |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C |
| Package | Tray |
| Product status | Active |
| Supplier Device Package | 32-HWQFN (5x5) |
| Voltage - Supply | 2.7V ~ 5.5V |
| 資料表 | 查看資料表PDF |
採購概覽
MPF5200AMBA1ES 的主要供貨及採購資訊。
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MPF5200AMBA1ES 詳細描述
Product Overview
The MPF5200AMBA1ES from NXP USA Inc. is an automotive power management integrated circuit intended for specialized power management tasks. The device is described as ASIL B and provides two low-voltage buck outputs, supporting compact board-level power management in surface-mount designs. It operates from a 2.7 V to 5.5 V supply range, draws 40 µA supply current, and is rated for an operating temperature range of -40°C to 125°C. The component uses a 32-PowerWFQFN package, with a 32-HWQFN (5x5) device package and wettable flank surface-mount construction.
Key Features
- Automotive-grade power management IC described as ASIL B.
- Provides two low-voltage buck outputs for compact power management designs.
- Operates from 2.7 V to 5.5 V and draws 40 µA supply current.
- Rated for an operating temperature range of -40°C to 125°C.
- Uses a 32-PowerWFQFN package with 32-HWQFN (5x5) device package and wettable flank mounting.
Applications
- Automotive electronic control units requiring compact surface-mount power management.
- Vehicle subsystems that need two low-voltage buck outputs within a 32-HWQFN (5x5) package.
- Safety-oriented automotive power domains where ASIL B is relevant.
Design & Procurement Notes
When selecting the MPF5200AMBA1ES, designers should confirm that the system supply remains within 2.7 V to 5.5 V and that the 40 µA supply current is compatible with the power budget. The -40°C to 125°C operating range supports automotive temperature conditions, but board thermal paths, airflow, and nearby heat sources still require validation. The 32-HWQFN (5x5) package and wettable flank construction call for a compact surface-mount layout, controlled pad geometry, and inspection access for solder joints. Because the device is described as an ASIL B power management IC with two low-voltage buck outputs, system-level safety analysis and output requirements should be checked against the final architecture rather than inferred from the part number alone.
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