料號

MPF5200AMBA3ESR2

POWER MANAGEMENT IC, PRE-PROG, 3

製造商
NXP USA Inc.
封裝
32-PowerWFQFN
庫存
1,367 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 NXP USA Inc.
產品分類 專用電源管理IC(PMIC)
Min Qty 5000
Mounting Type Surface Mount, Wettable Flank
Package Tape & Reel (TR)
Product status Active
Supplier Device Package 32-HWQFN (5x5)
資料表 查看資料表PDF
採購資訊

採購概覽

MPF5200AMBA3ESR2 的主要供貨及採購資訊。

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料號 MPF5200AMBA3ESR2
供貨狀態 列示庫存 1,367 pcs 當前數量需確認。
包裝與狀況 可確認包裝資訊 可按要求核對原廠包裝、標籤及包裝狀況。
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MPF5200AMBA3ESR2 詳細描述

Product Overview

The MPF5200AMBA3ESR2 from NXP USA Inc. is an automotive power management IC with ASIL B designation and two low-voltage buck outputs. The device uses a 32-PowerWFQFN package with a 32-HWQFN (5x5) package designation and a surface-mount wettable-flank mounting style. As a pre-programmed power management IC, it is positioned for board-level power control in automotive electronics where multiple managed supply rails are required. The package and mounting details support surface-mount assembly with wettable-flank construction, while the automotive and ASIL B descriptors place it within ASIL B-designated automotive power management contexts.

Key Features

  • Automotive power management IC with ASIL B designation and two low-voltage buck outputs.
  • Pre-programmed power management IC for board-level supply rail control.
  • 32-PowerWFQFN package with 32-HWQFN (5x5) package designation.
  • Surface-mount wettable-flank mounting style for automotive board assembly.

Applications

  • Automotive electronic control units requiring multiple managed power rails.
  • Vehicle subsystems that use two low-voltage buck outputs.
  • Automotive power management blocks where ASIL B is a relevant system-level requirement.

Design & Procurement Notes

When integrating MPF5200AMBA3ESR2, use the 32-HWQFN (5x5) package designation and wettable-flank surface-mount construction to define the PCB footprint and inspection approach. The two low-voltage buck outputs should be mapped to the board's required rail architecture, while the ASIL B automotive designation should be considered alongside the overall system safety documentation. Because the device is a pre-programmed power management IC, verify the intended configuration against the board design before layout and procurement.

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