PART NUMBER

MPF5200AMBA1ES

POWER MANAGEMENT IC, PRE-PROG, 3

Manufacturer
NXP USA Inc.
Package
32-PowerWFQFN
Stock
1,468 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer NXP USA Inc.
Product Category Specialized Power Management ICs (PMICs)
Current - Supply 40µA
Grade Automotive
Min Qty 490
Mounting Type Surface Mount, Wettable Flank
Operating Temperature -40°C ~ 125°C
Package Tray
Product status Active
Supplier Device Package 32-HWQFN (5x5)
Voltage - Supply 2.7V ~ 5.5V
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for MPF5200AMBA1ES.

Check Price & Availability
Part Number MPF5200AMBA1ES
Availability 1,468 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
SOURCING CAPABILITIES

Why Source from Antrex Electronics?

Independent distribution support for verified sourcing, inspection and international procurement requirements.

Independent Distribution Support

Shortage, obsolete and hard-to-find component sourcing for production and procurement requirements.

Traceability Review

Label, lot, date code and available supply-chain documentation can be reviewed before order confirmation.

Inspection & Testing

Visual inspection, X-ray and third-party testing support can be arranged when required.

Global Procurement Support

Support for OEM, EMS, distributors and international sourcing requirements across individual parts and BOM projects.

QUALITY & SOURCING

Credentials & Verification Support

Quality controls, traceability review and inspection support for electronic component sourcing.

ISO 9001 SGS
ISO 9001 Quality management
ESD Control
ESD Control Component handling
ERAI Membership
ERAI Industry sourcing support
Component Traceability
Traceability Label, lot & documentation review
Testing Support
Testing Support X-ray & third-party testing

Detailed Description for MPF5200AMBA1ES

Product Overview

The MPF5200AMBA1ES from NXP USA Inc. is an automotive power management integrated circuit intended for specialized power management tasks. The device is described as ASIL B and provides two low-voltage buck outputs, supporting compact board-level power management in surface-mount designs. It operates from a 2.7 V to 5.5 V supply range, draws 40 µA supply current, and is rated for an operating temperature range of -40°C to 125°C. The component uses a 32-PowerWFQFN package, with a 32-HWQFN (5x5) device package and wettable flank surface-mount construction.

Key Features

  • Automotive-grade power management IC described as ASIL B.
  • Provides two low-voltage buck outputs for compact power management designs.
  • Operates from 2.7 V to 5.5 V and draws 40 µA supply current.
  • Rated for an operating temperature range of -40°C to 125°C.
  • Uses a 32-PowerWFQFN package with 32-HWQFN (5x5) device package and wettable flank mounting.

Applications

  • Automotive electronic control units requiring compact surface-mount power management.
  • Vehicle subsystems that need two low-voltage buck outputs within a 32-HWQFN (5x5) package.
  • Safety-oriented automotive power domains where ASIL B is relevant.

Design & Procurement Notes

When selecting the MPF5200AMBA1ES, designers should confirm that the system supply remains within 2.7 V to 5.5 V and that the 40 µA supply current is compatible with the power budget. The -40°C to 125°C operating range supports automotive temperature conditions, but board thermal paths, airflow, and nearby heat sources still require validation. The 32-HWQFN (5x5) package and wettable flank construction call for a compact surface-mount layout, controlled pad geometry, and inspection access for solder joints. Because the device is described as an ASIL B power management IC with two low-voltage buck outputs, system-level safety analysis and output requirements should be checked against the final architecture rather than inferred from the part number alone.

MORE SOURCING OPTIONS

Explore More Sourcing Options

Continue sourcing by manufacturer, product category or procurement requirement.