MPF5020AVNA0ES
PF5020 - POWER MANAGEMENT IC, PR
- 產品分類
- 專用電源管理IC（PMIC）
- 封裝
- 40-VFQFN Exposed Pad
- 庫存
- 1,958 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | NXP Semiconductors |
|---|---|
| 產品分類 | 專用電源管理IC（PMIC） |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Min Qty | 77 |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Package | Bulk |
| Product status | Obsolete |
| Supplier Device Package | 40-HVQFN (6x6) |
| Voltage - Supply | 2.5V ~ 5.5V |
| 資料表 | 查看資料表PDF |
採購概覽
MPF5020AVNA0ES 的主要供貨及採購資訊。
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MPF5020AVNA0ES 詳細描述
Product Overview
The NXP Semiconductors MPF5020AVNA0ES is a PF5020 specialized power management IC intended for high-performance processor platforms based on i.MX 8 and S32x devices. It operates from a 2.5V to 5.5V supply range and is specified for an ambient operating temperature range of -40°C to 125°C. The device uses a 40-VFQFN Exposed Pad package with a 40-HVQFN (6x6) package designation and wettable flank surface-mount construction. This package form factor supports placement on surface-mount boards where power management is integrated near the host processor.
Key Features
- 2.5V to 5.5V supply voltage range.
- -40°C to 125°C ambient operating temperature range.
- 40-VFQFN Exposed Pad package with 40-HVQFN (6x6) package designation.
- Surface-mount construction with wettable flank.
- Intended for high-performance i.MX 8 and S32x processor based power management.
Applications
- Embedded computing boards using high-performance i.MX 8 processors.
- Control modules built around S32x processors.
- Surface-mount power management blocks in compact processor assemblies.
Design & Procurement Notes
When selecting this part, confirm that the board power input is within 2.5V to 5.5V and that the ambient temperature remains within -40°C to 125°C. The 40-VFQFN Exposed Pad package with 40-HVQFN (6x6) package designation requires an appropriate surface-mount land pattern and attention to thermal pad connection during schematic and layout review. Because the device is intended for processor-based power management, layout should keep the IC close to the host processor and related power domains while respecting package, thermal, and mechanical constraints.
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