MCP16501TD-E/RMB
PMIC FOR SAMA5DX/SAM9X6 MPUS
- 產品分類
- 專用電源管理IC（PMIC）
- 封裝
- 24-VFQFN Exposed Pad
- 庫存
- 3,232 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Microchip Technology |
|---|---|
| 產品分類 | 專用電源管理IC（PMIC） |
| Applications | Processor |
| Current - Supply | 14mA |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 24-VQFN (4x4) |
| Voltage - Supply | 2.7V ~ 5.5V |
| 資料表 | 查看資料表PDF |
採購概覽
MCP16501TD-E/RMB 的主要供貨及採購資訊。
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MCP16501TD-E/RMB 詳細描述
Product Overview
The MCP16501TD-E/RMB is a Microchip Technology power management IC intended for processor applications. It is a PMIC for SAMA5DX and SAM9X6 MPUs and uses a 24-VQFN (4x4) package. The device operates from a 2.7 V to 5.5 V supply and has a supply current of 14 mA. Its junction temperature range is -40°C to 125°C, and it uses surface-mount construction.
Key Features
- Designed for processor power management in SAMA5DX and SAM9X6 MPU applications.
- Supply voltage range of 2.7 V to 5.5 V.
- Supply current of 14 mA.
- Junction operating temperature range from -40°C to 125°C.
- 24-VQFN (4x4) surface-mount package with exposed pad.
Applications
- Embedded processor boards requiring a dedicated power management IC for SAMA5DX or SAM9X6 MPUs.
- Control and interface boards built around SAMA5DX or SAM9X6 MPU architectures.
- Space-constrained embedded designs using SAMA5DX or SAM9X6 MPUs with a 24-VQFN (4x4) PMIC.
- Microchip MPU-based computing platforms requiring processor power management support.
Design & Procurement Notes
For design use, confirm that the host processor is an SAMA5DX or SAM9X6 MPU and that the system supply falls within 2.7 V to 5.5 V. The 14 mA supply current and -40°C to 125°C junction temperature range should be considered in power budget and thermal calculations. The 24-VQFN (4x4) exposed-pad surface-mount package requires compatible PCB land pattern and soldering processes, and the exposed pad should be evaluated for thermal dissipation and electrical connection according to the board layout. Since the device is intended for processor power management, pairing it with non-SAMA5DX or non-SAM9X6 processors should not be assumed without separate design verification.
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