料號

MCP16501TC-E/RMB

PMIC FOR SAMA5DX/SAM9X6 MPUS

封裝
24-VFQFN Exposed Pad
庫存
3,985 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Microchip Technology
產品分類 專用電源管理IC(PMIC)
Applications Processor
Current - Supply 14mA
Min Qty 1
Mounting Type Surface Mount
Operating Temperature -40°C ~ 125°C (TJ)
Package Tape & Reel (TR),Cut Tape (CT)
Product status Active
Supplier Device Package 24-VQFN (4x4)
Voltage - Supply 2.7V ~ 5.5V
資料表 查看資料表PDF
採購資訊

採購概覽

MCP16501TC-E/RMB 的主要供貨及採購資訊。

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料號 MCP16501TC-E/RMB
供貨狀態 列示庫存 3,985 pcs 當前數量需確認。
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MCP16501TC-E/RMB 詳細描述

Product Overview

The MCP16501TC-E/RMB from Microchip Technology is a processor power management integrated circuit intended for use with SAMA5DX and SAM9X6 microprocessors. It is supplied in a 24-VQFN 4x4 surface-mount package with an exposed pad. The device operates from a 2.7 V to 5.5 V supply and has a supply current of 14 mA. Its junction temperature range is -40°C to 125°C, and it is intended for embedded processor power management designs where the supply and thermal limits match the board requirements.

Key Features

  • Processor PMIC for SAMA5DX and SAM9X6 microprocessors
  • 24-VQFN 4x4 exposed-pad package
  • Surface-mount mounting type
  • 2.7 V to 5.5 V supply voltage range
  • 14 mA supply current
  • -40°C to 125°C junction temperature range

Applications

  • Power management for embedded designs using SAMA5DX or SAM9X6 microprocessors
  • Processor power management in surface-mount embedded modules
  • Processor power management in embedded designs operating from a 2.7 V to 5.5 V supply

Design & Procurement Notes

Designers should verify that the system supply remains within the 2.7 V to 5.5 V range and that the 14 mA supply current is accounted for in the power budget. The 24-VQFN 4x4 exposed-pad package requires surface-mount assembly and a layout that supports the exposed pad. The -40°C to 125°C junction temperature limit should be checked against the final thermal design. Because the part is specified for SAMA5DX and SAM9X6 microprocessor applications, the MPU power requirements and board supply architecture should be reviewed against the board requirements.

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