料號

LCMXO640C-4TN144I

IC FPGA 113 I/O 144TQFP

封裝
144-LQFP
庫存
1,444 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package Tray
Product status Active
Series MachXO
Supplier Device Package 144-TQFP (20x20)
Voltage - Supply 1.71V ~ 3.465V
資料表 查看資料表PDF
採購資訊

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料號 LCMXO640C-4TN144I
供貨狀態 列示庫存 1,444 pcs 當前數量需確認。
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LCMXO640C-4TN144I 詳細描述

Product Overview

The LCMXO640C-4TN144I from Lattice Semiconductor Corporation is a MachXO family field programmable gate array (FPGA) for embedded logic functions. It integrates 640 logic elements and 80 LABs/CLBs, with 113 user I/O pins in a 144-LQFP surface-mount package. The device operates from a 1.71 V to 3.465 V supply and is specified for junction temperatures from -40°C to 100°C. This configuration supports board-level digital logic integration, peripheral interfacing, and reconfigurable control functions where a programmable logic device is needed.

Key Features

  • MachXO family FPGA with 640 logic elements and 80 LABs/CLBs.
  • 113 user I/O pins for board-level digital interfacing.
  • 144-LQFP package (144-TQFP 20x20), surface mount.
  • 1.71 V to 3.465 V supply voltage range.
  • Operating temperature range of -40°C to 100°C (TJ).

Applications

  • Embedded digital control logic in board-level systems.
  • Interface and glue logic for multiple peripherals using the available I/O.
  • Reconfigurable logic functions in development or production hardware.
  • FPGA logic implementation within a 144-pin package.

Design & Procurement Notes

When selecting the LCMXO640C-4TN144I, check that the system power supply can operate within 1.71 V to 3.465 V and that the 144-TQFP (20x20) package fits the PCB and assembly constraints. The 113 I/O count should be compared against required peripheral connections, while the 640 logic elements and 80 LABs/CLBs provide the available programmable logic budget. Thermal design should account for junction temperature up to 100°C and operation down to -40°C. For embedded board-level designs, verify pin assignment, I/O requirements, and package density early, because these device parameters affect routing and layout.

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