LCMXO640C-4TN144I
IC FPGA 113 I/O 144TQFP
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 144-LQFP
- 庫存
- 1,444 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 144-TQFP (20x20) |
| Voltage - Supply | 1.71V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO640C-4TN144I 的主要供貨及採購資訊。
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LCMXO640C-4TN144I 詳細描述
Product Overview
The LCMXO640C-4TN144I from Lattice Semiconductor Corporation is a MachXO family field programmable gate array (FPGA) for embedded logic functions. It integrates 640 logic elements and 80 LABs/CLBs, with 113 user I/O pins in a 144-LQFP surface-mount package. The device operates from a 1.71 V to 3.465 V supply and is specified for junction temperatures from -40°C to 100°C. This configuration supports board-level digital logic integration, peripheral interfacing, and reconfigurable control functions where a programmable logic device is needed.
Key Features
- MachXO family FPGA with 640 logic elements and 80 LABs/CLBs.
- 113 user I/O pins for board-level digital interfacing.
- 144-LQFP package (144-TQFP 20x20), surface mount.
- 1.71 V to 3.465 V supply voltage range.
- Operating temperature range of -40°C to 100°C (TJ).
Applications
- Embedded digital control logic in board-level systems.
- Interface and glue logic for multiple peripherals using the available I/O.
- Reconfigurable logic functions in development or production hardware.
- FPGA logic implementation within a 144-pin package.
Design & Procurement Notes
When selecting the LCMXO640C-4TN144I, check that the system power supply can operate within 1.71 V to 3.465 V and that the 144-TQFP (20x20) package fits the PCB and assembly constraints. The 113 I/O count should be compared against required peripheral connections, while the 640 logic elements and 80 LABs/CLBs provide the available programmable logic budget. Thermal design should account for junction temperature up to 100°C and operation down to -40°C. For embedded board-level designs, verify pin assignment, I/O requirements, and package density early, because these device parameters affect routing and layout.
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