LCMXO640C-4MN132C
IC FPGA 101 I/O 132CSBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 132-LFBGA, CSPBGA
- 庫存
- 1,407 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 132-CSPBGA (8x8) |
| Voltage - Supply | 1.71V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO640C-4MN132C 的主要供貨及採購資訊。
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LCMXO640C-4MN132C 詳細描述
Product Overview
The LCMXO640C-4MN132C is a Lattice Semiconductor Corporation MachXO field programmable gate array intended for embedded logic functions in a compact surface-mount package. The device provides 640 logic elements or cells, organized as 80 LABs or CLBs, and exposes 101 I/O pins for interfacing with external circuitry. Its supply range is 1.71 V to 3.465 V, and its operating junction temperature range is 0 °C to 85 °C. The component is supplied in a 132-LFBGA, CSPBGA package, with a 132-CSPBGA (8 x 8) device package, making it suitable for board designs that require programmable interconnect and moderate I/O density in a small footprint.
Key Features
- MachXO FPGA architecture with 640 logic elements or cells and 80 LABs or CLBs for programmable embedded logic.
- 101 I/O pins support external interfacing, control signals, and configurable connectivity in compact board layouts.
- Supply voltage range of 1.71 V to 3.465 V for operation within the defined electrical conditions.
- Operating junction temperature range of 0 °C to 85 °C for thermal-aware embedded system design.
- 132-LFBGA, CSPBGA package with 132-CSPBGA (8 x 8) device package designation for surface-mount assembly.
- Lattice Semiconductor Corporation MachXO series device identified by part number LCMXO640C-4MN132C.
Applications
- Embedded control logic where programmable sequencing, state machines, or conditional signal processing replace fixed-function logic.
- I/O expansion for systems that require additional external pins and configurable connectivity in compact board layouts.
- Glue logic between processors, memory, sensors, displays, or peripheral devices in embedded assemblies.
- Programmable interconnect for signal routing and logic interfacing where board-level connectivity must be adjusted during development.
Design & Procurement Notes
Design considerations should focus on matching the 101 available I/O pins to the required external interfaces while keeping supply and signal conditions within the 1.71 V to 3.465 V range. The 0 °C to 85 °C junction temperature limit requires thermal budgeting for nearby components and enclosure conditions. The 132-CSPBGA (8 x 8) surface-mount package supports compact layouts, but pad access, rework, and assembly process compatibility should be reviewed. The 640 logic elements and 80 LABs or CLBs are suitable for modest programmable logic tasks rather than large gate-array implementations.
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