LCMXO640C-4BN256I
IC FPGA 159 I/O 256CABGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 256-LFBGA, CSPBGA
- 庫存
- 1,465 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 256-CABGA (14x14) |
| Voltage - Supply | 1.71V ~ 3.465V |
| 資料表 | 查看資料表PDF |
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LCMXO640C-4BN256I 的主要供貨及採購資訊。
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LCMXO640C-4BN256I 詳細描述
Product Overview
The LCMXO640C-4BN256I is a Lattice Semiconductor Corporation MachXO field programmable gate array (FPGA) intended for embedded programmable logic design. It provides 640 logic elements or cells, 80 LABs/CLBs, and 159 I/O, supporting board-level logic integration and interface adaptation. The device uses a 256-LFBGA, CSPBGA package, identified as 256-CABGA (14x14), and is mounted by surface-mount assembly. Its specified supply voltage range is 1.71V to 3.465V, and its operating temperature range is -40°C to 100°C at the junction.
Key Features
- MachXO FPGA architecture with 640 logic elements or cells and 80 LABs/CLBs.
- 159 I/O for board-level signal routing, control logic, and interface expansion.
- 1.71V to 3.465V supply voltage range.
- -40°C to 100°C (TJ) operating temperature range.
- 256-LFBGA, CSPBGA package, 256-CABGA (14x14) device package, surface-mount.
Applications
- Embedded control logic where programmable board functions replace discrete logic components.
- I/O expansion and signal routing for microcontroller-based systems.
- Glue logic and protocol bridging between digital subsystems.
- Timing or sequencing logic for board-level digital systems.
Design & Procurement Notes
Designers should account for the 159 I/O count, package footprint, and supply voltage range during PCB layout and power planning. The 256-CABGA (14x14) and 256-LFBGA, CSPBGA package descriptions should be reconciled with the final board footprint and land pattern. The 1.71V to 3.465V supply range and -40°C to 100°C (TJ) operating temperature range are relevant to power sequencing, thermal management, and junction temperature budgeting. Because the device is a surface-mount FPGA, assembly considerations include paste volume, reflow profile, and inspection of the BGA/CSPBGA area. The 640 logic elements, 80 LABs/CLBs, and 159 I/O resources should be mapped against the required logic functions before selecting the part.
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