料號

LCMXO640C-4BN256I

IC FPGA 159 I/O 256CABGA

封裝
256-LFBGA, CSPBGA
庫存
1,465 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package Tray
Product status Active
Series MachXO
Supplier Device Package 256-CABGA (14x14)
Voltage - Supply 1.71V ~ 3.465V
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料號 LCMXO640C-4BN256I
供貨狀態 列示庫存 1,465 pcs 當前數量需確認。
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LCMXO640C-4BN256I 詳細描述

Product Overview

The LCMXO640C-4BN256I is a Lattice Semiconductor Corporation MachXO field programmable gate array (FPGA) intended for embedded programmable logic design. It provides 640 logic elements or cells, 80 LABs/CLBs, and 159 I/O, supporting board-level logic integration and interface adaptation. The device uses a 256-LFBGA, CSPBGA package, identified as 256-CABGA (14x14), and is mounted by surface-mount assembly. Its specified supply voltage range is 1.71V to 3.465V, and its operating temperature range is -40°C to 100°C at the junction.

Key Features

  • MachXO FPGA architecture with 640 logic elements or cells and 80 LABs/CLBs.
  • 159 I/O for board-level signal routing, control logic, and interface expansion.
  • 1.71V to 3.465V supply voltage range.
  • -40°C to 100°C (TJ) operating temperature range.
  • 256-LFBGA, CSPBGA package, 256-CABGA (14x14) device package, surface-mount.

Applications

  • Embedded control logic where programmable board functions replace discrete logic components.
  • I/O expansion and signal routing for microcontroller-based systems.
  • Glue logic and protocol bridging between digital subsystems.
  • Timing or sequencing logic for board-level digital systems.

Design & Procurement Notes

Designers should account for the 159 I/O count, package footprint, and supply voltage range during PCB layout and power planning. The 256-CABGA (14x14) and 256-LFBGA, CSPBGA package descriptions should be reconciled with the final board footprint and land pattern. The 1.71V to 3.465V supply range and -40°C to 100°C (TJ) operating temperature range are relevant to power sequencing, thermal management, and junction temperature budgeting. Because the device is a surface-mount FPGA, assembly considerations include paste volume, reflow profile, and inspection of the BGA/CSPBGA area. The 640 logic elements, 80 LABs/CLBs, and 159 I/O resources should be mapped against the required logic functions before selecting the part.

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