ICE40LP4K-CM225
IC FPGA 167 I/O 225UCBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 225-VFBGA
- 庫存
- 1,473 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | iCE40™ LP |
| Supplier Device Package | 225-UCBGA (7x7) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
ICE40LP4K-CM225 的主要供貨及採購資訊。
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ICE40LP4K-CM225 詳細描述
Product Overview
The ICE40LP4K-CM225 from Lattice Semiconductor Corporation is an iCE40 LP field-programmable gate array (FPGA) intended for embedded logic implementation. It provides 3,520 logic elements or cells, 440 LABs/CLBs, 81,920 total RAM bits, and 167 input/output pins in a 225-UCBGA (7 x 7) surface-mount package. The device operates with a supply voltage range of 1.14 V to 1.26 V and a junction temperature range of -40°C to 100°C.
Key Features
- 3,520 logic elements or cells and 440 LABs/CLBs provide programmable logic resources for embedded FPGA designs.
- 81,920 total RAM bits support on-device memory structures for data buffering and logic implementation.
- 167 I/O pins enable connection to multiple external interfaces, sensors, or peripheral devices.
- 225-VFBGA / 225-UCBGA (7 x 7) surface-mount package supports compact PCB placement.
- Electrical and thermal limits include a supply voltage range of 1.14 V to 1.26 V and an operating junction temperature range of -40°C to 100°C.
Applications
- Embedded control logic requiring custom digital state machines and peripheral control.
- Sensor and actuator interface aggregation using 167 I/O pins.
- Bridging between different digital data paths in embedded systems.
- Data buffering and processing using 81,920 total RAM bits.
- Timing and sequencing functions implemented with programmable logic cells.
Design & Procurement Notes
Designers should map the required logic cells, LABs/CLBs, RAM bits, and I/O count against the device resources before finalizing the architecture. The 225-UCBGA (7 x 7) package requires a matching PCB land pattern, solder paste stencil, and surface-mount assembly process. Power supply design must keep the supply voltage within 1.14 V to 1.26 V across operating conditions, and thermal design should account for a junction temperature range of -40°C to 100°C. Because the device is an FPGA, pin assignment and resource utilization should be reviewed during schematic capture and layout to confirm that the selected package and I/O count meet the board-level interface needs.
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