ICE40UL640-CM36AITR
IC FPGA 26 I/O 36UCBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 36-VFBGA
- 庫存
- 4,000 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tape & Reel (TR),Cut Tape (CT),Digi-Reel® |
| Product status | Active |
| Series | iCE40 UltraLite™ |
| Supplier Device Package | 36-UCBGA (2.5x2.5) |
| Voltage - Supply | 1.14V ~ 1.26V |
| 資料表 | 查看資料表PDF |
採購概覽
ICE40UL640-CM36AITR 的主要供貨及採購資訊。
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ICE40UL640-CM36AITR 詳細描述
Product Overview
The ICE40UL640-CM36AITR from Lattice Semiconductor Corporation is an iCE40 UltraLite field-programmable gate array (FPGA) supplied in a 36-VFBGA package. It provides 640 logic elements, 80 LABs/CLBs, 57344 total RAM bits, and 26 I/O pins. The device uses a 1.14V to 1.26V supply and is specified for surface-mount installation. Its operating temperature range is -40°C to 100°C (TJ), and its lifecycle status is Active.
Key Features
- 640 logic elements and 80 LABs/CLBs support small-scale digital logic functions.
- 57344 total RAM bits provide on-chip storage for compact data-handling tasks.
- 26 I/O pins are available for board-level connection to external digital devices.
- 1.14V to 1.26V supply range is required for operation.
- 36-VFBGA package with 36-UCBGA (2.5x2.5) supplier device package supports surface-mount assembly.
- Operating temperature is specified from -40°C to 100°C (TJ).
Applications
- Embedded digital control logic where a small FPGA can replace discrete gate-level circuitry.
- Sensor data aggregation using available I/O pins.
- Board-level glue logic between low-density digital subsystems.
Design & Procurement Notes
For design use, verify that the available logic, RAM, and I/O resources are sufficient for the target function. Confirm the 36-VFBGA footprint, 36-UCBGA (2.5x2.5) package dimensions, and surface-mount assembly process. The supply rail must be controlled within 1.14V to 1.26V, and thermal design should account for the -40°C to 100°C (TJ) range. The Active lifecycle status can be used in procurement planning, while the small resource count makes this part most suitable for compact logic tasks rather than high-density FPGA designs.
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