料號

ICE40LP1K-CM49

IC FPGA 35 I/O 49UCBGA

封裝
49-VFBGA
庫存
1,321 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package Tray
Product status Active
Series iCE40™ LP
Supplier Device Package 49-UCBGA (3x3)
Voltage - Supply 1.14V ~ 1.26V
資料表 查看資料表PDF
採購資訊

採購概覽

ICE40LP1K-CM49 的主要供貨及採購資訊。

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料號 ICE40LP1K-CM49
供貨狀態 列示庫存 1,321 pcs 當前數量需確認。
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ICE40LP1K-CM49 詳細描述

Product Overview

The ICE40LP1K-CM49 is a Lattice Semiconductor Corporation field-programmable gate array (FPGA) in the iCE40™ LP series. It provides 1280 logic elements/cells, 160 LABs/CLBs, 65536 total RAM bits, and 35 I/O in a 49-VFBGA package, with a 49-UCBGA (3x3) package designation. The device operates from a 1.14V to 1.26V supply and is surface mounted for embedded logic and programmable interface designs.

Key Features

  • 1280 logic elements/cells and 160 LABs/CLBs provide programmable digital logic resources.
  • 65536 total RAM bits support on-chip buffering and small data structures.
  • 35 I/O pins provide external signal connectivity for programmable logic designs.
  • 1.14V to 1.26V supply voltage range defines operating supply conditions.
  • 49-VFBGA case and 49-UCBGA (3x3) package designation, surface mount mounting type.
  • -40°C to 100°C (TJ) operating temperature range.

Applications

  • Control logic for compact programmable systems
  • Digital sensor interface and preprocessing using available I/O and logic resources
  • Protocol bridging between digital interfaces
  • Programmable glue logic or peripheral expansion

Design & Procurement Notes

Designers should verify that the 1.14V to 1.26V supply range, the 49-VFBGA and 49-UCBGA (3x3) package footprint, and the 35 I/O count fit the board and power architecture. The 1280 logic elements/cells, 160 LABs/CLBs, and 65536 total RAM bits should be compared against the target design's logic and storage requirements before implementation. The -40°C to 100°C (TJ) operating temperature range should be considered with junction thermal management and system enclosure conditions. The RAM bits and I/O count should be mapped against required buffering, pin assignments, and interface widths. The logic resources should be evaluated against the planned state machine and datapath complexity.

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