XCVU13P-2FHGB2104I
High-density Virtex UltraScale+ FPGA with 3.78M logic cells and 2104-FCBGA package for advanced computing
- ПРОИЗВОДИТЕЛЬ
- AMD
- КАТЕГОРИЯ ТОВАРА
- Конфигурационные ПЗУ для FPGA
- Корпус
- BGA
- Склад
- 1,500 шт.
- Наличие
- Текущее количество требует подтверждения.
Характеристики товара
| ПРОИЗВОДИТЕЛЬ | AMD |
|---|---|
| КАТЕГОРИЯ ТОВАРА | Конфигурационные ПЗУ для FPGA |
| Adaptive Logic Modules (ALMs) | 216,000 |
| Applications | AI Acceleration, Data Centers, High-Speed Networking, Video Processing, Aerospace and Defense Systems |
| Block RAM | 94.5 Mbit |
| CLB / Logic Array Blocks | 216,000 |
| Clock Management | MMCM, PLL |
| Core Supply Voltage | 0.825V to 0.876V |
| Device Family | XCVU13P |
| Distributed RAM | 48.3 Mbit |
| DSP Slices | 12,288 |
| High-Speed Transceivers | 128 GTY Transceivers |
| I/O Supply Voltage | 3.3V |
| Logic Cells | 3,780,000 |
| Logic Elements | 3,780,000 |
| Maximum Operating Frequency | 775 MHz |
| Maximum Transceiver Data Rate | 32.75 Gb/s |
| Mounting Type | Surface Mount Technology (SMT) |
| Operating Temperature Range | -40°C to +100°C |
| Package | FCBGA-2104 |
| Package Size | 52.5 mm × 52.5 mm |
| Process Technology | 16 nm FinFET |
| Series | Virtex UltraScale+ |
| Speed Grade | -2 |
| Temperature Grade | Industrial |
| Total RAM Bits | 514,867,200 Bits |
| User I/O Pins | 702 |
| Техническая документация | Запросить даташит |
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Подробное описание XCVU13P-2FHGB2104I
Product Overview
XCVU13P-2FHGB2104I is an AMD Xilinx Virtex UltraScale+ Field Programmable Gate Array (FPGA) designed for ultra-high-performance computing, advanced networking and large-scale hardware acceleration applications. Based on 16nm FinFET UltraScale+ architecture, this device integrates 3.78 million logic cells, 96.8 Mbit embedded memory, 12,288 DSP resources and 128 GTY high-speed transceivers. Featuring a -2 speed grade, industrial temperature range and 2104-ball FCBGA package, XCVU13P-2FHGB2104I delivers exceptional processing capability, massive parallel computing performance and high-bandwidth connectivity for AI acceleration, data centers, communications and advanced embedded systems.
Key Features
Manufacturer: AMD Xilinx
Part Number: XCVU13P-2FHGB2104I
Product Type: Field Programmable Gate Array (FPGA)
Series: Virtex UltraScale+
Architecture: UltraScale+ Programmable Logic Architecture
Process Technology: 16nm FinFET
Speed Grade: -2
Device Grade: Industrial Grade
Logic Cells: 3,780,000 Logic Cells
Configurable Logic Blocks: 216,000 CLBs
Look-Up Tables (LUTs): Approx. 1.73M LUTs
Flip-Flops: Approx. 3.45M Registers
DSP Slices: 12,288 DSP48E2 Slices
Embedded Block RAM: 96.8 Mbit
Distributed RAM: Approx. 48.3 Mbit
High-Speed Transceivers: 128 GTY Transceivers
Maximum Transceiver Data Rate: Up to 32.75Gb/s
User I/O Count: 702 I/O Pins
Core Supply Voltage: 0.825V to 0.876V
I/O Supply Voltage: Up to 3.3V
Package Type: FCBGA-2104
Package Size: 52.5mm × 52.5mm
Mounting Type: Surface Mount Technology (SMT)
Operating Temperature Range: -40°C to +100°C
Clock Management: MMCM and PLL integrated resources
Memory Interface: DDR4/DDR3 memory interface support
Configuration Technology: SRAM-based FPGA configuration
Features: Extreme logic density, high-speed serial connectivity, advanced DSP processing and flexible hardware acceleration
Typical Applications: AI acceleration, cloud computing, 5G communication, high-performance networking, medical imaging, aerospace systems and industrial automation
Datasheet: XCVU13P-2FHGB2104I datasheet PDF available for technical verification before production use.
Applications
XCVU13P-2FHGB2104I is designed for demanding applications requiring massive parallel processing, high-speed data handling and programmable hardware acceleration. Typical applications include artificial intelligence inference platforms, data center acceleration cards, high-speed network equipment, wireless infrastructure, radar systems, medical imaging equipment, industrial vision systems and advanced embedded computing platforms.
Quality & Sourcing
Antrex Electronics can support XCVU13P-2FHGB2104I sourcing with stock availability checks, RFQ quotation, package confirmation, date code review and shipment arrangement. For project-based purchasing, customers can provide quantity requirements, delivery schedules, application details and technical specifications for faster quotation support.
For quality assurance, Antrex Electronics can assist with product photos, marking verification, visual inspection and third-party testing services when required. OEM manufacturers, communication equipment suppliers, AI hardware developers and electronic component buyers are welcome to submit BOM lists or hard-to-find FPGA requirements for sourcing assistance.
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