MPF5024CMMA0ESR2
POWER MANAGEMENT IC, PRE-PROG, 4
- Manufacturer
- NXP USA Inc.
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 40-VFQFN Exposed Pad
- Stock
- 1,488 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | NXP USA Inc. |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | High Performance i.MX 8 Processor Based |
| Grade | Automotive |
| Min Qty | 2000 |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Package | Tape & Reel (TR) |
| Product status | Active |
| Qualification | AEC-Q100 |
| Supplier Device Package | 40-HVQFN (6x6) |
| Voltage - Supply | 2.5V ~ 5.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MPF5024CMMA0ESR2.
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Detailed Description for MPF5024CMMA0ESR2
Product Overview
The MPF5024CMMA0ESR2 from NXP USA Inc. is a pre-programmed power management IC described for automotive embedded processor platforms. It is associated with i.MX 8/6 and S32 systems and includes 4 Buck. The device operates from a 2.5V to 5.5V supply and is specified for an ambient temperature range of -40°C to 125°C. It is offered in a 40-VFQFN exposed-pad package, with a 40-HVQFN (6x6) package and surface-mount wettable flank mounting.
Key Features
- Pre-programmed power management IC for automotive embedded processor applications
- Supply voltage range: 2.5V to 5.5V
- Operating temperature range: -40°C to 125°C (TA)
- Automotive grade with AEC-Q100 qualification
- 40-VFQFN exposed-pad package with 40-HVQFN (6x6) package designation
- Surface-mount wettable flank mounting
- 4 Buck for i.MX 8/6 and S32 platforms
Applications
- High-performance i.MX 8 processor-based systems
- Automotive embedded processor subsystems using i.MX 8/6 or S32 devices
Design & Procurement Notes
Design considerations include the 2.5V to 5.5V supply range, -40°C to 125°C ambient operating range, and the 40-VFQFN exposed-pad package with wettable flank surface-mount construction. The 40-HVQFN (6x6) package footprint and exposed pad should be reflected in PCB layout and thermal management planning. The AEC-Q100 automotive qualification supports use in automotive embedded processor platforms, while the pre-programmed 4 Buck configuration and i.MX 8/6 or S32 context should be matched to the required processor power architecture. Procurement and design planning should confirm the exact processor power rail requirements before using the pre-programmed 4 Buck configuration.
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