MPF5024AVNA0ES
PF5024
Quick Answer: MPF5024AVNA0ES is a PF5024 power management integrated circuit from NXP USA Inc.
- Manufacturer
- NXP USA Inc.
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 40-VFQFN Exposed Pad
- Stock
- 2,865 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | NXP USA Inc. |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | High Performance i.MX 8 Processor Based |
| Min Qty | 1 |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Package | Tray |
| Product status | Active |
| Supplier Device Package | 40-HVQFN (6x6) |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MPF5024AVNA0ES.
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Detailed Description for MPF5024AVNA0ES
Product Overview
MPF5024AVNA0ES is a PF5024 power management integrated circuit from NXP USA Inc. for i.MX 8/6 and S32 platforms. The PF5024 is a QM industrial power management IC with four buck regulators. The component is housed in a 40-VFQFN exposed pad package with a 6x6 40-HVQFN footprint. It is specified for surface-mount assembly using wettable flanks, and its operating temperature range is from -40°C to 125°C (TA).
Key Features
- PF5024 power management IC for i.MX 8/6 and S32 platforms
- Four buck regulator channels
- QM industrial designation
- 40-VFQFN exposed pad package
- 6x6 40-HVQFN package footprint
- Surface-mount wettable flank construction
- Operating temperature range of -40°C to 125°C (TA)
Applications
- High-performance i.MX 8 processor based embedded systems
- Industrial embedded platforms using i.MX 6 or S32 processors
- Multi-rail power delivery for compact surface-mount processor boards
Design & Procurement Notes
Design considerations include routing the exposed pad for thermal dissipation and inspecting wettable flanks during assembly. The four buck regulator channels support multiple processor rails, while the -40°C to 125°C (TA) range and industrial designation should be considered when defining operating environments. The 6x6 40-HVQFN footprint and 40-VFQFN package should be reviewed during PCB layout, pad definition, and reflow profile planning. The exposed pad and wettable flank construction also affect solder joint inspection and thermal pad clearance. Because the device is associated with i.MX 8/6 and S32 platforms, rail sequencing, load transients, and processor power tree requirements should be reviewed against the four buck regulator channels. The QM designation is a device descriptor and should be considered alongside the specified package, temperature range, and mounting type.
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