PART NUMBER

MPF5024AVNA0ES

PF5024

Quick Answer: MPF5024AVNA0ES is a PF5024 power management integrated circuit from NXP USA Inc.

Manufacturer
NXP USA Inc.
Package
40-VFQFN Exposed Pad
Stock
2,865 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer NXP USA Inc.
Product Category Specialized Power Management ICs (PMICs)
Applications High Performance i.MX 8 Processor Based
Min Qty 1
Mounting Type Surface Mount, Wettable Flank
Operating Temperature -40°C ~ 125°C (TA)
Package Tray
Product status Active
Supplier Device Package 40-HVQFN (6x6)
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for MPF5024AVNA0ES.

Check Price & Availability
Part Number MPF5024AVNA0ES
Availability 2,865 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for MPF5024AVNA0ES

Product Overview

MPF5024AVNA0ES is a PF5024 power management integrated circuit from NXP USA Inc. for i.MX 8/6 and S32 platforms. The PF5024 is a QM industrial power management IC with four buck regulators. The component is housed in a 40-VFQFN exposed pad package with a 6x6 40-HVQFN footprint. It is specified for surface-mount assembly using wettable flanks, and its operating temperature range is from -40°C to 125°C (TA).

Key Features

  • PF5024 power management IC for i.MX 8/6 and S32 platforms
  • Four buck regulator channels
  • QM industrial designation
  • 40-VFQFN exposed pad package
  • 6x6 40-HVQFN package footprint
  • Surface-mount wettable flank construction
  • Operating temperature range of -40°C to 125°C (TA)

Applications

  • High-performance i.MX 8 processor based embedded systems
  • Industrial embedded platforms using i.MX 6 or S32 processors
  • Multi-rail power delivery for compact surface-mount processor boards

Design & Procurement Notes

Design considerations include routing the exposed pad for thermal dissipation and inspecting wettable flanks during assembly. The four buck regulator channels support multiple processor rails, while the -40°C to 125°C (TA) range and industrial designation should be considered when defining operating environments. The 6x6 40-HVQFN footprint and 40-VFQFN package should be reviewed during PCB layout, pad definition, and reflow profile planning. The exposed pad and wettable flank construction also affect solder joint inspection and thermal pad clearance. Because the device is associated with i.MX 8/6 and S32 platforms, rail sequencing, load transients, and processor power tree requirements should be reviewed against the four buck regulator channels. The QM designation is a device descriptor and should be considered alongside the specified package, temperature range, and mounting type.

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