MT53E256M32D2DS-053 AUT:B
IC DRAM 8GBIT 1.866GHZ 200WFBGA
- Manufacturer
- Micron Technology Inc.
- Product Category
- Memory ICs
- Package
- 200-WFBGA
- Stock
- 2,022 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Micron Technology Inc. |
|---|---|
| Product Category | Memory ICs |
| Clock Frequency | 1.866 GHz |
| Grade | Automotive |
| Memory Format | DRAM |
| Memory Organization | 256M x 32 |
| Memory Size | 8Gbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TC) |
| Package | Tray |
| Product status | Obsolete |
| Qualification | AEC-Q100 |
| Supplier Device Package | 200-WFBGA (10x14.5) |
| Technology | SDRAM - Mobile LPDDR4 |
| Voltage - Supply | 1.1V |
| Datasheet | Request Datasheet |
Procurement Snapshot
Key supply and purchasing information for MT53E256M32D2DS-053 AUT:B.
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Detailed Description for MT53E256M32D2DS-053 AUT:B
Product Overview
The Micron Technology Inc. MT53E256M32D2DS-053 AUT:B is an 8Gbit volatile DRAM memory IC implemented as mobile LPDDR4 SDRAM. It provides a 256M x 32 memory organization and operates at a 1.866 GHz clock frequency with a 1.1V supply voltage. The device is supplied in a 200-WFBGA surface-mount package identified as 200-WFBGA (10x14.5), and it is specified for an operating temperature range of -40°C to 125°C (TC). The part carries an Automotive grade designation and AEC-Q100 qualification.
Key Features
- 8Gbit volatile DRAM memory capacity.
- Mobile LPDDR4 SDRAM technology.
- 256M x 32 memory organization.
- 1.866 GHz clock frequency.
- 1.1V supply voltage.
- -40°C to 125°C (TC) operating temperature range.
- Automotive grade with AEC-Q100 qualification.
- 200-WFBGA (10x14.5) surface-mount package.
Applications
- Mobile consumer devices and embedded platforms that require volatile DRAM in an LPDDR4 memory subsystem.
- Automotive electronic modules that use this AEC-Q100-qualified device and operate within the -40°C to 125°C (TC) case-temperature range.
- Memory subsystems that use the 256M x 32 organization and 1.866 GHz clock frequency for data access.
Design & Procurement Notes
When selecting this device, verify that the PCB footprint matches the 200-WFBGA (10x14.5) surface-mount package and that the power supply can provide the 1.1V supply voltage. The 256M x 32 organization and 1.866 GHz clock frequency should be matched to the memory controller interface and bandwidth requirements. For designs using the Automotive grade and AEC-Q100 qualification, confirm that the thermal environment remains within the -40°C to 125°C (TC) case-temperature range and that volatile DRAM behavior is acceptable for the application.
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