MT53D512M32D2DS-053 AAT:D
IC DRAM 16GBIT 1.866GHZ 200WFBGA
- Manufacturer
- Micron Technology Inc.
- Product Category
- Memory ICs
- Package
- 200-WFBGA
- Stock
- 4,144 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Micron Technology Inc. |
|---|---|
| Product Category | Memory ICs |
| Clock Frequency | 1.866 GHz |
| Grade | Automotive |
| Memory Format | DRAM |
| Memory Organization | 512M x 32 |
| Memory Size | 16Gbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Package | Tray |
| Product status | Obsolete |
| Qualification | AEC-Q100 |
| Supplier Device Package | 200-WFBGA (10x14.5) |
| Technology | SDRAM - Mobile LPDDR4 |
| Voltage - Supply | 1.1V |
| Datasheet | Request Datasheet |
Procurement Snapshot
Key supply and purchasing information for MT53D512M32D2DS-053 AAT:D.
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Detailed Description for MT53D512M32D2DS-053 AAT:D
Product Overview
The MT53D512M32D2DS-053 AAT:D from Micron Technology Inc. is a volatile DRAM memory IC implemented with Mobile LPDDR4 SDRAM technology. It provides 16Gbit of memory arranged as 512M x 32 and operates at a 1.866 GHz clock frequency from a 1.1V supply. The surface-mount 200-WFBGA (10x14.5) package is specified for an operating temperature range of -40°C ~ 105°C (TC), and the part carries an Automotive grade designation with AEC-Q100 qualification. It supports volatile data storage for embedded and mobile platforms.
Key Features
- 16Gbit volatile DRAM capacity with 512M x 32 organization
- Mobile LPDDR4 SDRAM technology at a 1.866 GHz clock frequency
- 1.1V supply voltage for system power planning
- Operating temperature range of -40°C ~ 105°C (TC)
- Automotive grade with AEC-Q100 qualification
- 200-WFBGA (10x14.5) surface-mount package
Applications
- Automotive embedded processing systems requiring qualified volatile DRAM
- Mobile computing subsystems using low-voltage LPDDR4 memory
- Embedded processing subsystems requiring volatile DRAM buffering
Design & Procurement Notes
When integrating this device, confirm that the system memory controller supports Mobile LPDDR4, the 512M x 32 organization, and the 1.866 GHz clock frequency. The 1.1V supply and 105°C maximum case temperature should be included in power and thermal design. The 200-WFBGA (10x14.5) package requires a matching land pattern and assembly process. Signal-integrity planning should account for the 1.866 GHz clock frequency and 200-WFBGA (10x14.5) fanout. For automotive platforms, the Automotive grade and AEC-Q100 qualification can be considered, while exact part marking and system-level validation remain the designer's responsibility.
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