MT53E128M32D2DS-053 WT:A
IC DRAM 4GBIT 1.866GHZ 200WFBGA
- Manufacturer
- Micron Technology Inc.
- Product Category
- Memory ICs
- Package
- 200-WFBGA
- Stock
- 2,407 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Micron Technology Inc. |
|---|---|
| Product Category | Memory ICs |
| Clock Frequency | 1.866 GHz |
| Memory Format | DRAM |
| Memory Organization | 128M x 32 |
| Memory Size | 4Gbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -30°C ~ 85°C (TC) |
| Package | Tray |
| Product status | Last Time Buy |
| Supplier Device Package | 200-WFBGA (10x14.5) |
| Technology | SDRAM - Mobile LPDDR4 |
| Voltage - Supply | 1.1V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MT53E128M32D2DS-053 WT:A.
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Detailed Description for MT53E128M32D2DS-053 WT:A
Product Overview
The MT53E128M32D2DS-053 WT:A from Micron Technology Inc. is a volatile DRAM memory IC based on SDRAM - Mobile LPDDR4 technology. It provides 4Gbit of memory organized as 128M x 32 and operates with a 1.866 GHz clock frequency at a 1.1V supply voltage. The device is packaged in a surface-mount 200-WFBGA (10x14.5) package and has an operating temperature range of -30°C to 85°C (TC).
Key Features
- 4Gbit volatile DRAM memory capacity with a 128M x 32 organization.
- Mobile LPDDR4 SDRAM technology with a 1.1V supply voltage.
- 1.866 GHz clock frequency.
- Surface-mount 200-WFBGA (10x14.5) package.
- Operating temperature range of -30°C to 85°C (TC).
Applications
- Mobile computing and handheld platforms using LPDDR4 DRAM as main memory.
- Embedded processing systems that use a 4Gbit volatile DRAM device.
- Portable electronic devices that integrate a 1.1V memory interface with a compatible controller.
Design & Procurement Notes
Designers should verify that the memory controller supports Mobile LPDDR4, the 128M x 32 organization, and the 1.866 GHz clock frequency. The 1.1V supply voltage and -30°C to 85°C (TC) operating range should be included in power and thermal planning. The 200-WFBGA (10x14.5) surface-mount package requires a compatible PCB footprint and assembly process. Because the device is volatile DRAM, system designs should account for data retention behavior when power is removed.
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