MT41K256M16TW-107 IT:P
IC DRAM 4GBIT PAR 96FBGA
- Manufacturer
- Micron Technology Inc.
- Product Category
- Memory ICs
- Package
- 96-TFBGA
- Stock
- 4,027 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Micron Technology Inc. |
|---|---|
| Product Category | Memory ICs |
| Access Time | 20 ns |
| Clock Frequency | 933 MHz |
| Memory Format | DRAM |
| Memory Interface | Parallel |
| Memory Organization | 256M x 16 |
| Memory Size | 4Gbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 95°C (TC) |
| Package | Box |
| Product status | Active |
| Supplier Device Package | 96-FBGA (8x14) |
| Technology | SDRAM - DDR3L |
| Voltage - Supply | 1.283V ~ 1.45V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MT41K256M16TW-107 IT:P.
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Detailed Description for MT41K256M16TW-107 IT:P
Product Overview
MT41K256M16TW-107 IT:P is a Micron Technology Inc. memory integrated circuit for systems using DDR3L SDRAM. The device provides a 4Gbit volatile DRAM array organized as 256M x 16 and accessed through a parallel interface. It operates from a 1.283V to 1.45V supply, supports a 933 MHz clock frequency, and has a 20 ns access time. The 96-FBGA (8x14) package is intended for surface-mount assembly, with a specified operating temperature range of -40°C to 95°C (TC).
Key Features
- 4Gbit volatile DRAM memory with a 256M x 16 organization
- DDR3L SDRAM technology
- Parallel memory interface with a 933 MHz clock frequency
- 20 ns access time
- Supply voltage range of 1.283V to 1.45V
- Operating temperature range of -40°C to 95°C (TC)
- 96-FBGA (8x14) surface-mount package
Applications
- Main memory or working memory in computing platforms that use a DDR3L parallel memory interface
- Volatile data buffering in embedded systems requiring a 4Gbit DRAM capacity and 256M x 16 organization
- Memory subsystems in equipment designed to operate within the -40°C to 95°C (TC) temperature range
- Surface-mount board designs using 96-FBGA (8x14) packages for parallel DRAM connections
Design & Procurement Notes
Designers should verify that the host controller supports DDR3L signaling, a parallel memory interface, and the 256M x 16 organization before selecting the part. The 1.283V to 1.45V supply range and -40°C to 95°C (TC) operating temperature range should be checked against the board power architecture and thermal conditions. The 933 MHz clock frequency and 20 ns access time require attention to timing closure and signal integrity on the memory bus. The 96-FBGA (8x14) surface-mount package should be matched to the assembly process and footprint.
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