MT41K64M16TW-107:J TR
IC DRAM 1GBIT PAR 96FBGA
- Manufacturer
- Micron Technology Inc.
- Product Category
- Memory ICs
- Package
- 96-TFBGA
- Stock
- 3,927 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Micron Technology Inc. |
|---|---|
| Product Category | Memory ICs |
| Access Time | 20 ns |
| Clock Frequency | 933 MHz |
| Memory Format | DRAM |
| Memory Interface | Parallel |
| Memory Organization | 64M x 16 |
| Memory Size | 1Gbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 96-FBGA (8x14) |
| Technology | SDRAM - DDR3L |
| Voltage - Supply | 1.283V ~ 1.45V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MT41K64M16TW-107:J TR.
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Detailed Description for MT41K64M16TW-107:J TR
Product Overview
The MT41K64M16TW-107:J TR from Micron Technology Inc. is a 1Gbit DDR3L SDRAM device with a 64M x 16 organization and a parallel memory interface. It operates from a 1.283V to 1.45V supply, supports a 933 MHz clock frequency, and specifies a 20 ns access time. The volatile DRAM is housed in a 96-TFBGA package, with a 96-FBGA (8x14) package designation, for surface-mount assembly. The 0°C to 95°C (TC) operating temperature range applies to use in electronic systems requiring DDR3L memory density and a parallel memory interface.
Key Features
- Memory type is volatile DRAM.
- Technology is DDR3L SDRAM.
- Memory size is 1Gbit with a 64M x 16 organization.
- Memory interface is parallel.
- Clock frequency is 933 MHz and access time is 20 ns.
- Supply voltage range is 1.283V to 1.45V.
- Operating temperature range is 0°C to 95°C (TC).
- Surface-mount 96-TFBGA package with 96-FBGA (8x14) designation.
Applications
- Main memory in computing platforms that use DDR3L interfaces.
- Data buffering in embedded systems with parallel DRAM access.
- Memory expansion in systems with parallel DRAM interfaces.
Design & Procurement Notes
Design considerations should align the 1.283V to 1.45V supply, 933 MHz clock, and 20 ns access time with the host memory controller timing budget. The 64M x 16 organization and parallel interface require matching address, command, and data routing on the PCB, while the 96-TFBGA surface-mount package with a 96-FBGA (8x14) package designation influences land pattern and stencil layout. The 0°C to 95°C (TC) range should be reviewed against expected ambient and board-level thermal conditions. Procurement planning should verify the selected package, PCB land pattern, and system-level validation needed for DDR3L operation.
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