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PART NUMBER

MT41K64M16TW-107:J TR

IC DRAM 1GBIT PAR 96FBGA

Manufacturer
Micron Technology Inc.
Product Category
Memory ICs
Package
96-TFBGA
Stock
3,927 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer Micron Technology Inc.
Product Category Memory ICs
Access Time 20 ns
Clock Frequency 933 MHz
Memory Format DRAM
Memory Interface Parallel
Memory Organization 64M x 16
Memory Size 1Gbit
Memory Type Volatile
Mounting Type Surface Mount
Operating Temperature 0°C ~ 95°C (TC)
Package Tape & Reel (TR),Cut Tape (CT)
Product status Active
Supplier Device Package 96-FBGA (8x14)
Technology SDRAM - DDR3L
Voltage - Supply 1.283V ~ 1.45V
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for MT41K64M16TW-107:J TR.

Check Price & Availability
Part Number MT41K64M16TW-107:J TR
Availability 3,927 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for MT41K64M16TW-107:J TR

Product Overview

The MT41K64M16TW-107:J TR from Micron Technology Inc. is a 1Gbit DDR3L SDRAM device with a 64M x 16 organization and a parallel memory interface. It operates from a 1.283V to 1.45V supply, supports a 933 MHz clock frequency, and specifies a 20 ns access time. The volatile DRAM is housed in a 96-TFBGA package, with a 96-FBGA (8x14) package designation, for surface-mount assembly. The 0°C to 95°C (TC) operating temperature range applies to use in electronic systems requiring DDR3L memory density and a parallel memory interface.

Key Features

  • Memory type is volatile DRAM.
  • Technology is DDR3L SDRAM.
  • Memory size is 1Gbit with a 64M x 16 organization.
  • Memory interface is parallel.
  • Clock frequency is 933 MHz and access time is 20 ns.
  • Supply voltage range is 1.283V to 1.45V.
  • Operating temperature range is 0°C to 95°C (TC).
  • Surface-mount 96-TFBGA package with 96-FBGA (8x14) designation.

Applications

  • Main memory in computing platforms that use DDR3L interfaces.
  • Data buffering in embedded systems with parallel DRAM access.
  • Memory expansion in systems with parallel DRAM interfaces.

Design & Procurement Notes

Design considerations should align the 1.283V to 1.45V supply, 933 MHz clock, and 20 ns access time with the host memory controller timing budget. The 64M x 16 organization and parallel interface require matching address, command, and data routing on the PCB, while the 96-TFBGA surface-mount package with a 96-FBGA (8x14) package designation influences land pattern and stencil layout. The 0°C to 95°C (TC) range should be reviewed against expected ambient and board-level thermal conditions. Procurement planning should verify the selected package, PCB land pattern, and system-level validation needed for DDR3L operation.

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