PART NUMBER

MPF100TS-FCSG325I

IC FPGA 170 I/O 325FPGA

Quick Answer: The MPF100TS-FCSG325I from Microchip Technology is a PolarFire field programmable gate array (FPGA) intended for embedded programmable logic designs.

Manufacturer
Microchip Technology
Package
325-LFBGA, FCBGA
Stock
1,352 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer Microchip Technology
Product Category FPGA - Field Programmable Gate Array
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package Tray
Product status Active
Series PolarFire™
Supplier Device Package 325-FCBGA (11x11)
Voltage - Supply 0.97V ~ 1.08V
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for MPF100TS-FCSG325I.

Check Price & Availability
Part Number MPF100TS-FCSG325I
Availability 1,352 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for MPF100TS-FCSG325I

Product Overview

The MPF100TS-FCSG325I from Microchip Technology is a PolarFire field programmable gate array (FPGA) intended for embedded programmable logic designs. The device provides 109,000 logic elements or cells, 7,782,400 total RAM bits, and 170 I/O. It operates with a supply voltage range of 0.97 V to 1.08 V and a junction temperature operating range of -40°C to 100°C. The component uses a 325-LFBGA, FCBGA package, with a 325-FCBGA (11x11) device package, and is intended for surface-mount assembly.

Key Features

  • PolarFire FPGA architecture with 109,000 logic elements or cells.
  • 7,782,400 total RAM bits available on-device.
  • 170 I/O pins for external board connectivity.
  • Supply voltage range of 0.97 V to 1.08 V.
  • Operating temperature range of -40°C to 100°C (TJ).
  • Surface-mount 325-LFBGA, FCBGA package with 325-FCBGA (11x11) device package.

Applications

  • Embedded control logic in systems that require configurable gate array resources rather than fixed-function logic.
  • Data buffering or state-machine implementation using available on-device RAM bits.
  • I/O logic and interface routing in designs that can use the available 170 I/O pins.

Design & Procurement Notes

When selecting the MPF100TS-FCSG325I, confirm that the system power supply can maintain the 0.97 V to 1.08 V supply range and that the thermal design keeps the junction within -40°C to 100°C. The 109,000 logic elements or cells, 7,782,400 total RAM bits, and 170 I/O should be compared against the required logic, memory, and interface budget. Board layout should account for the surface-mount 325-LFBGA, FCBGA package and the 325-FCBGA (11x11) device package, including land pattern, solder paste, and assembly constraints.

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