MPF100TL-FCG484I
IC FPGA 244 I/O 484FBGA
Quick Answer: The MPF100TL-FCG484I is a Microchip Technology PolarFire™ field programmable gate array (FPGA) for programmable logic designs.
- Manufacturer
- Microchip Technology
- Product Category
- FPGA - Field Programmable Gate Array
- Package
- 484-BFBGA
- Stock
- 1,260 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Microchip Technology |
|---|---|
| Product Category | FPGA - Field Programmable Gate Array |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | PolarFire™ |
| Supplier Device Package | 484-FPBGA (19x19) |
| Voltage - Supply | 0.97V ~ 1.08V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MPF100TL-FCG484I.
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Detailed Description for MPF100TL-FCG484I
Product Overview
The MPF100TL-FCG484I is a Microchip Technology PolarFire™ field programmable gate array (FPGA) for programmable logic designs. The device provides 109,000 logic elements or cells, 7,782,400 total RAM bits, and 244 input/output pins. It operates from a 0.97 V to 1.08 V supply and is specified for an operating temperature range of -40 °C to 100 °C (TJ). The package is a 484-BFBGA, with a 484-FPBGA (19 x 19) package designation.
Key Features
- PolarFire™ FPGA from Microchip Technology.
- 109,000 logic elements or cells.
- 7,782,400 total RAM bits.
- 244 input/output pins.
- 0.97 V to 1.08 V supply voltage.
- Operating temperature range of -40 °C to 100 °C (TJ).
- Surface-mount 484-BFBGA package.
- 484-FPBGA (19 x 19) package designation.
Applications
- Programmable control logic in embedded systems.
- Bridging between multiple digital interfaces using the available I/O.
- Custom buffering and data-path processing using on-chip RAM bits.
- Reconfigurable logic implementation for digital system designs.
Design & Procurement Notes
When selecting the MPF100TL-FCG484I, confirm that the board power architecture can provide the 0.97 V to 1.08 V supply and that the surface-mount assembly process supports the 484-BFBGA package. The 244 I/O count, 109,000 logic elements or cells, and 7,782,400 total RAM bits should be compared with the planned logic, memory, and interface requirements. The -40 °C to 100 °C (TJ) operating temperature range should be checked against expected junction-temperature conditions in the final board layout. The 484-FPBGA (19 x 19) package designation should also be matched to the PCB footprint and land pattern.
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