MIC5166YML-TR
IC PWR SUP 3A HS DDR TERM 10MLF
Quick Answer: The MIC5166YML-TR from Microchip Technology is a surface-mount 3A DDR termination power management IC intended for memory interface applications.
- Manufacturer
- Microchip Technology
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 10-VFDFN Exposed Pad, 10-MLF®
- Stock
- 4,631 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Microchip Technology |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | DDR Terminator |
| Current - Supply | 1.6mA |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 10-MLF® (3x3) |
| Voltage - Supply | 2.5V ~ 5.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MIC5166YML-TR.
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Detailed Description for MIC5166YML-TR
Product Overview
The MIC5166YML-TR from Microchip Technology is a surface-mount 3A DDR termination power management IC intended for memory interface applications. The device is a specialized power management IC. It operates from a 2.5 V to 5.5 V supply and consumes 1.6 mA of supply current. It is specified for an operating temperature range of -40°C to 125°C. The package is a 10-VFDFN exposed-pad, 10-MLF (3x3) device, supporting surface-mount assembly on DDR termination circuitry.
Key Features
- DDR termination PMIC
- 3A DDR termination
- 2.5 V to 5.5 V supply voltage range
- 1.6 mA supply current
- -40°C to 125°C operating temperature range
- 10-VFDFN exposed-pad, 10-MLF (3x3) surface-mount package
Applications
- DDR memory termination rails
- Memory interface power management
Design & Procurement Notes
Board designers should account for the 10-MLF (3x3) exposed-pad footprint and surface-mount assembly when laying out DDR termination circuitry. The 2.5 V to 5.5 V supply range and 1.6 mA supply current affect input rail selection and quiescent power budget, while the -40°C to 125°C operating temperature range should be checked against the target environment. The 3A DDR termination rating should be validated against the memory termination current demand and PCB copper and thermal design. Because the package includes an exposed pad, pad connection and board-level thermal management should be considered during layout. The 10-VFDFN exposed-pad package should be included in the bill of materials and assembly documentation as a surface-mount component. The 10-VFDFN and 10-MLF package designations should be matched to the chosen surface-mount assembly process. The supply voltage range should be checked against the available system rail before finalizing the power tree.
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