MCP16501TA-E/RMB
PMIC FOR SAMA5DX/SAM9X6 MPUS
Quick Answer: MCP16501TA-E/RMB is a Microchip Technology processor power management integrated circuit intended for SAMA5DX and SAM9X6 MPUs.
- Manufacturer
- Microchip Technology
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 24-VFQFN Exposed Pad
- Stock
- 11,396 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Microchip Technology |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Processor |
| Current - Supply | 14mA |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 24-VQFN (4x4) |
| Voltage - Supply | 2.7V ~ 5.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MCP16501TA-E/RMB.
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Detailed Description for MCP16501TA-E/RMB
Product Overview
MCP16501TA-E/RMB is a Microchip Technology processor power management integrated circuit intended for SAMA5DX and SAM9X6 MPUs. The device is supplied in a 24-VQFN (4x4) package with a 24-VFQFN exposed pad and surface-mount mounting. It operates from a 2.7V to 5.5V supply, draws 14mA supply current, and is rated for an operating temperature range of -40°C to 125°C (TJ). The listed .It is categorized as a specialized power management integrated circuit for processors.
Key Features
- Microchip Technology PMIC for SAMA5DX and SAM9X6 MPUs
- 24-VQFN (4x4) package with 24-VFQFN exposed pad
- 2.7V to 5.5V supply voltage range
- 14mA supply current
- -40°C to 125°C (TJ) operating temperature
- Surface-mount mounting
Applications
- Embedded systems using SAMA5DX MPUs
- Embedded systems using SAM9X6 MPUs
- Surface-mount processor power boards requiring a PMIC
Design & Procurement Notes
Designers should verify that the system power rail stays within 2.7V to 5.5V and that the junction temperature remains within -40°C to 125°C under load. The 24-VQFN (4x4) exposed-pad package requires a surface-mount footprint and pad layout suitable for processor PMIC mounting. The 24-VQFN (4x4) designation identifies the package form used for placement and routing. The exposed pad should be considered during PCB layout and thermal path planning. The 14mA supply current should be included in power budget calculations. The Active product status supports current production use, but lifecycle status should be checked during procurement. The surface-mount package makes mechanical assembly and rework considerations relevant to the 24-VQFN (4x4) form.
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