TLE94713ESV33XUMA1
IC SYST BASIS CHIP TSDSO24-1
Quick Answer: The TLE94713ESV33XUMA1 from Infineon Technologies is a Lite SBC system basis chip and power management IC intended for CAN Automotive applications.
- Manufacturer
- Infineon Technologies
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
- Stock
- 4,495 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Infineon Technologies |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | CAN Automotive |
| Grade | Automotive |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Qualification | AEC-Q100 |
| Series | Lite SBC |
| Supplier Device Package | PG-TSDSO-24-1 |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for TLE94713ESV33XUMA1.
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Detailed Description for TLE94713ESV33XUMA1
Product Overview
The TLE94713ESV33XUMA1 from Infineon Technologies is a Lite SBC system basis chip and power management IC intended for CAN Automotive applications. It is qualified to AEC-Q100 and is offered in a 24-TSSOP (0.154", 3.90mm Width) Exposed Pad package, with the supplier device package designation PG-TSDSO-24-1. The part is a surface-mount device positioned within specialized power management ICs for automotive electronic systems. The device is associated with the TSDSO24-1 package designation.
Key Features
- AEC-Q100 qualification supports automotive-grade system requirements.
- Automotive grade designation.
- Intended for CAN Automotive application environments.
- System basis chip designation.
- 24-TSSOP (0.154", 3.90mm Width) Exposed Pad package.
- PG-TSDSO-24-1 supplier device package.
- Surface-mount construction for printed circuit board assembly.
- Lite SBC series designation.
- Specialized power management IC classification.
Applications
- Automotive CAN communication nodes requiring power management.
- Automotive electronic modules using CAN-based control networks.
Design & Procurement Notes
For design planning, confirm that the 24-TSSOP exposed-pad footprint and PG-TSDSO-24-1 package outline match the PCB layout, pad geometry, and surface-mount assembly process. The exposed pad should be considered in PCB copper and soldering process design. The AEC-Q100 automotive qualification should be considered as part of the system-level qualification plan, especially when the target application is CAN Automotive. Review the surrounding power management architecture, CAN communication requirements, and Lite SBC series integration assumptions before final selection. Because the device is a system basis chip-type IC, document how its specialized power management role interfaces with the rest of the automotive electronic system.
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