MPC855TVR50D4

Product Overview

NXP USA Inc. MPC855TVR50D4 is an MPC85xx-series embedded microprocessor built around a single-core, 32-bit MPC8xx processor running at 50 MHz. The device combines a communications processor module (CPM), an integrated DRAM controller, and Ethernet connectivity, including one 10 Mbps port and one 10/100 Mbps port. It uses a 357-BBGA surface-mount package with a 357-PBGA (25x25) package designation. The I/O voltage is 3.3 V, and the operating temperature range is 0°C to 95°C (TJ). Graphics acceleration is absent.

Key Features

• Single-core 32-bit MPC8xx processor operating at 50 MHz.
• Communications processor module (CPM) co-processor is included.
• Integrated Ethernet interfaces provide one 10 Mbps port and one 10/100 Mbps port.
• An integrated DRAM controller supports external memory.
• Additional interfaces include HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, and UART/USART.
• I/O voltage is 3.3 V.
• Surface-mount 357-BBGA package with 357-PBGA (25x25) package designation.
• Operating temperature range is 0°C to 95°C (TJ).
• Graphics acceleration is absent.

Applications

• Embedded communications processing where the CPM and Ethernet interfaces support protocol handling and data movement.
• Networked control systems that require 10/100 Mbps Ethernet together with serial interfaces such as UART/USART and SPI.
• Link integration using HDLC/SDLC or TDM interfaces in point-to-point or channelized communication equipment.
• Memory-mapped embedded subsystems that use the integrated DRAM controller for main memory.

Design & Procurement Notes

Design planning should account for the 357-BBGA surface-mount package, including PCB land pattern, routing, and assembly process compatibility. The 0°C to 95°C (TJ) operating temperature range requires thermal verification under actual board and enclosure conditions. Because the device specifies 3.3 V I/O, connected logic levels and interface signaling should be matched accordingly. The integrated DRAM controller should be considered when planning external memory. The CPM, Ethernet, HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, and UART/USART interfaces should be reflected in firmware, driver, and board-level interface allocation.