TPS25740BRGET
USB TYPE-C AND USB PD SOURCE CO
- 產品分類
- 專用電源管理IC(PMIC)
- 封裝
- 24-VFQFN Exposed Pad
- 庫存
- 1,500 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Texas Instruments |
|---|---|
| 產品分類 | 專用電源管理IC(PMIC) |
| Applications | USB, Type-C Controller |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Not For New Designs |
| Supplier Device Package | 24-VQFN (4x4) |
| Voltage - Supply | 4.65V ~ 25V |
| 資料表 | 查看資料表PDF |
採購概覽
TPS25740BRGET 的主要供貨及採購資訊。
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TPS25740BRGET 詳細描述
Product Overview
The TPS25740BRGET from Texas Instruments is a power management IC for USB Type-C and USB PD source control. It is a surface-mount device in a 24-VFQFN exposed-pad package. The supply voltage range is 4.65V to 25V, and the specified operating temperature range is -40°C to 125°C. This controller is for designs that require a compact USB Type-C control function integrated with power management circuitry. The exposed pad provides a thermal connection point for surface-mount assembly, while the package footprint supports standard PCB layout and assembly.
Key Features
- USB Type-C controller IC function for USB PD source control
- Supply voltage range of 4.65V to 25V
- Operating temperature range of -40°C to 125°C
- Surface-mount package in 24-VFQFN exposed pad
- 24-VQFN (4x4) device package
Applications
- USB Type-C source ports in host devices
- USB PD source control in power delivery systems
- Embedded power management for USB Type-C ports
Design & Procurement Notes
Design considerations should focus on the 4.65V to 25V supply window, the -40°C to 125°C operating range, and the 24-VFQFN exposed-pad thermal path. The 24-VQFN (4x4) package and surface-mount mounting type require footprint, pad, and soldering compatibility during PCB layout. Procurement notes should confirm the exact part number TPS25740BRGET and device package when selecting the device for USB Type-C and USB PD source control. The specified supply and temperature ranges should be aligned with the final board operating conditions. The exposed pad should be considered in thermal and board-level layout.
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