BQ500511RHAR
IC WIRELESS TRANSMITTER 40VQFN
- 產品分類
- 專用電源管理IC(PMIC)
- 封裝
- 40-VFQFN Exposed Pad
- 庫存
- 2,500 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Texas Instruments |
|---|---|
| 產品分類 | 專用電源管理IC(PMIC) |
| Applications | Wireless Power Transmitter |
| Current - Supply | 3.45mA |
| Min Qty | 2500 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package | Tape & Reel (TR) |
| Product status | Not For New Designs |
| Supplier Device Package | 40-VQFN (6x6) |
| Voltage - Supply | 2V ~ 3.6V |
| 資料表 | 查看資料表PDF |
採購概覽
BQ500511RHAR 的主要供貨及採購資訊。
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BQ500511RHAR 詳細描述
Product Overview
The BQ500511RHAR from Texas Instruments is a wireless power transmitter PMIC for surface-mount power-management designs. It uses a 40-VFQFN Exposed Pad package and has the 40-VQFN (6x6) package designation. The device operates from a 2 V to 3.6 V supply and has a supply current of 3.45 mA. Its operating temperature range is -40°C to 85°C. These characteristics define the part as a transmitter-side IC for wireless power transfer applications that must fit within a surface-mount package.
Key Features
- Wireless power transmitter PMIC function
- 40-VFQFN Exposed Pad package
- Surface-mount mounting type
- 2 V to 3.6 V supply voltage
- 3.45 mA supply current
- -40°C to 85°C operating temperature
- 40-VQFN (6x6) package designation
Applications
- Transmitter-side power management in wireless power transfer systems
- Wireless charging pad transmitter circuits
- Surface-mount wireless power transmitter modules for embedded assemblies
Design & Procurement Notes
When selecting this part, verify that the system supply remains within 2 V to 3.6 V and that the 3.45 mA supply current is compatible with the power budget. Confirm that the expected operating temperature conditions fall within -40°C to 85°C, and account for package and PCB thermal effects around the exposed pad. The 40-VFQFN Exposed Pad format and 40-VQFN (6x6) package designation require a surface-mount footprint, solder paste, reflow profile, and pad layout that match the mechanical and electrical requirements of the board. Check the package drawing and land pattern before finalizing the PCB layout and assembly documentation. The supply range and current value should also be checked against the system power source and any shared rails.
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