料號

BQ500511RHAR

IC WIRELESS TRANSMITTER 40VQFN

製造商
Texas Instruments
封裝
40-VFQFN Exposed Pad
庫存
2,500 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Texas Instruments
產品分類 專用電源管理IC(PMIC)
Applications Wireless Power Transmitter
Current - Supply 3.45mA
Min Qty 2500
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package Tape & Reel (TR)
Product status Not For New Designs
Supplier Device Package 40-VQFN (6x6)
Voltage - Supply 2V ~ 3.6V
資料表 查看資料表PDF
採購資訊

採購概覽

BQ500511RHAR 的主要供貨及採購資訊。

查詢價格及供貨
料號 BQ500511RHAR
供貨狀態 列示庫存 2,500 pcs 當前數量需確認。
包裝與狀況 可確認包裝資訊 可按要求核對原廠包裝、標籤及包裝狀況。
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BQ500511RHAR 詳細描述

Product Overview

The BQ500511RHAR from Texas Instruments is a wireless power transmitter PMIC for surface-mount power-management designs. It uses a 40-VFQFN Exposed Pad package and has the 40-VQFN (6x6) package designation. The device operates from a 2 V to 3.6 V supply and has a supply current of 3.45 mA. Its operating temperature range is -40°C to 85°C. These characteristics define the part as a transmitter-side IC for wireless power transfer applications that must fit within a surface-mount package.

Key Features

  • Wireless power transmitter PMIC function
  • 40-VFQFN Exposed Pad package
  • Surface-mount mounting type
  • 2 V to 3.6 V supply voltage
  • 3.45 mA supply current
  • -40°C to 85°C operating temperature
  • 40-VQFN (6x6) package designation

Applications

  • Transmitter-side power management in wireless power transfer systems
  • Wireless charging pad transmitter circuits
  • Surface-mount wireless power transmitter modules for embedded assemblies

Design & Procurement Notes

When selecting this part, verify that the system supply remains within 2 V to 3.6 V and that the 3.45 mA supply current is compatible with the power budget. Confirm that the expected operating temperature conditions fall within -40°C to 85°C, and account for package and PCB thermal effects around the exposed pad. The 40-VFQFN Exposed Pad format and 40-VQFN (6x6) package designation require a surface-mount footprint, solder paste, reflow profile, and pad layout that match the mechanical and electrical requirements of the board. Check the package drawing and land pattern before finalizing the PCB layout and assembly documentation. The supply range and current value should also be checked against the system power source and any shared rails.

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