SI5324C-C-GMR

Product Overview

The SI5324C-C-GMR from Skyworks Solutions Inc. is an active application-specific clock and timing integrated circuit in the DSPLL® series. It is supplied in a 36-VFQFN exposed-pad package, with a supplier device package of 36-QFN (6x6), and is intended for surface-mount assembly. The device is described for clock/frequency multiplication, jitter attenuation, and multiplexer functions in Ethernet WAN, SONET/SDH/STM, and video timing contexts. It includes one circuit, accepts a clock input, and provides one output with a listed input-to-output ratio of 2:2. The maximum frequency value supplied is 346MHz, and the output interface families listed are CML, CMOS, LVDS, and LVPECL.

Key Features

• Skyworks Solutions Inc. DSPLL® series part SI5324C-C-GMR; lifecycle status Active; PLL listed as Yes.
• Clock/frequency multiplier, jitter attenuator, and multiplexer function for Ethernet WAN, SONET/SDH/STM, and video timing applications.
• One circuit with clock input and one output; input-to-output ratio 2:2; differential input/output Yes/Yes.
• Maximum frequency 346MHz; output families CML, CMOS, LVDS, and LVPECL; supply voltage 1.71V to 3.63V.
• Operating temperature range -40°C to 85°C; 36-VFQFN exposed pad, 36-QFN (6x6), surface mount.

Applications

• Ethernet WAN equipment timing paths that require clock multiplication, jitter attenuation, or clock multiplexing.
• SONET/SDH/STM transport systems requiring jitter attenuation or clock/frequency multiplication.
• Video systems requiring clock/frequency multiplication or multiplexed timing signals.

Design & Procurement Notes

When selecting the SI5324C-C-GMR, verify that the board-level supply can operate within the specified 1.71V to 3.63V range and that downstream logic can accept one of the listed output families: CML, CMOS, LVDS, or LVPECL. Confirm that the design requires a single circuit with clock input, one output, a 2:2 input-to-output ratio, and differential input/output behavior. The 36-VFQFN exposed-pad package and 36-QFN (6x6) supplier device package require a surface-mount footprint appropriate for the exposed pad. The supplied lifecycle status is Active.