MC68EC000EI16R2
IC MPU M680X0 16MHZ 68PLCC
- 製造商
- NXP USA Inc.
- 產品分類
- 微控制器 - MCU
- 封裝
- 68-LCC (J-Lead)
- 庫存
- 2,755 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | NXP USA Inc. |
|---|---|
| 產品分類 | 微控制器 - MCU |
| Core Processor | EC000 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package | Tape & Reel (TR) |
| Product status | Obsolete |
| Series | M680x0 |
| Speed | 16MHz |
| Supplier Device Package | 68-PLCC (24.21x24.21) |
| 資料表 | 查看資料表PDF |
採購概覽
MC68EC000EI16R2 的主要供貨及採購資訊。
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MC68EC000EI16R2 詳細描述
Product Overview
The MC68EC000EI16R2 from NXP USA Inc. is an EC000 microprocessor in the M680x0 series. It provides a single 32-bit core with a 16 MHz operating speed and 5.0 V I/O. The device uses a surface-mount 68-PLCC package with a 24.21 mm by 24.21 mm body size and has no graphics acceleration.
Key Features
- EC000 core processor within the M680x0 series
- Single core with 32-bit bus width
- 16 MHz core operating speed
- 5.0 V I/O voltage
- No graphics acceleration
- Surface-mount 68-PLCC package with 24.21 mm x 24.21 mm body size
Applications
- Embedded control subsystems in electronic equipment where a 32-bit microprocessor coordinates system functions
- Instrumentation and measurement systems that use processor control for data handling and system coordination
- Embedded processing platforms designed around the M680x0 core architecture
Design & Procurement Notes
When integrating the MC68EC000EI16R2, verify that the board layout supports the surface-mount 68-PLCC package and the 24.21 mm by 24.21 mm body size. The 5.0 V I/O voltage should be matched with compatible external interfaces and signal levels, and the 0°C to 70°C ambient operating range should be considered for board-level thermal design. Because the device has no graphics acceleration, any display-related processing must be provided by the surrounding system architecture rather than by the processor itself. The 16 MHz operating speed and single-core 32-bit configuration are also relevant to overall system timing, software partitioning, and external interface planning.
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