MC68EC000CAA16
IC MPU M680X0 16MHZ 64QFP
- 製造商
- NXP USA Inc.
- 產品分類
- 微控制器 - MCU
- 封裝
- 64-QFP
- 庫存
- 7,213 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | NXP USA Inc. |
|---|---|
| 產品分類 | 微控制器 - MCU |
| Core Processor | EC000 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package | Tray |
| Product status | Obsolete |
| Series | M680x0 |
| Speed | 16MHz |
| Supplier Device Package | 64-QFP (14x14) |
| 資料表 | 查看資料表PDF |
採購概覽
MC68EC000CAA16 的主要供貨及採購資訊。
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MC68EC000CAA16 詳細描述
Product Overview
The MC68EC000CAA16 from NXP USA Inc. is a single-core 32-bit microprocessor in the M680x0 series, centered on the EC000 core and operating at 16 MHz. The device uses a surface-mount 64-QFP package with a 14 mm by 14 mm body and 5.0 V I/O levels. It has no graphics acceleration and operates over an ambient temperature range of -40°C to 85°C. It is intended for embedded control and processing tasks where a 32-bit microprocessor, 16 MHz operation, and 5.0 V I/O compatibility are required.
Key Features
- Core processor: EC000, single core, 32-bit bus width.
- Operating speed: 16 MHz.
- Series: M680x0.
- Package: 64-QFP, surface-mount, 14 mm by 14 mm.
- I/O voltage: 5.0 V.
- Operating temperature: -40°C to 85°C ambient.
- Graphics acceleration: none.
Applications
- Embedded control units using a 32-bit microprocessor and 5.0 V I/O.
- Equipment control operating from -40°C to 85°C ambient.
- Systems requiring external display or graphics hardware because no graphics acceleration is provided.
Design & Procurement Notes
When selecting the MC68EC000CAA16, verify that the PCB footprint matches the 64-QFP surface-mount package and that the 14 mm by 14 mm body fits the enclosure. The 5.0 V I/O voltage requires compatible external logic or peripheral devices. The 16 MHz operating speed sets expectations for processing speed and interface timing, while the absence of graphics acceleration means any display or graphics function must be handled by external components. The -40°C to 85°C ambient temperature range should be checked against the final product environment, including board-level thermal effects.
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