料號

MC68EC000CAA16

IC MPU M680X0 16MHZ 64QFP

製造商
NXP USA Inc.
產品分類
微控制器 - MCU
封裝
64-QFP
庫存
7,213 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 NXP USA Inc.
產品分類 微控制器 - MCU
Core Processor EC000
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Package Tray
Product status Obsolete
Series M680x0
Speed 16MHz
Supplier Device Package 64-QFP (14x14)
資料表 查看資料表PDF
採購資訊

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料號 MC68EC000CAA16
供貨狀態 列示庫存 7,213 pcs 當前數量需確認。
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MC68EC000CAA16 詳細描述

Product Overview

The MC68EC000CAA16 from NXP USA Inc. is a single-core 32-bit microprocessor in the M680x0 series, centered on the EC000 core and operating at 16 MHz. The device uses a surface-mount 64-QFP package with a 14 mm by 14 mm body and 5.0 V I/O levels. It has no graphics acceleration and operates over an ambient temperature range of -40°C to 85°C. It is intended for embedded control and processing tasks where a 32-bit microprocessor, 16 MHz operation, and 5.0 V I/O compatibility are required.

Key Features

  • Core processor: EC000, single core, 32-bit bus width.
  • Operating speed: 16 MHz.
  • Series: M680x0.
  • Package: 64-QFP, surface-mount, 14 mm by 14 mm.
  • I/O voltage: 5.0 V.
  • Operating temperature: -40°C to 85°C ambient.
  • Graphics acceleration: none.

Applications

  • Embedded control units using a 32-bit microprocessor and 5.0 V I/O.
  • Equipment control operating from -40°C to 85°C ambient.
  • Systems requiring external display or graphics hardware because no graphics acceleration is provided.

Design & Procurement Notes

When selecting the MC68EC000CAA16, verify that the PCB footprint matches the 64-QFP surface-mount package and that the 14 mm by 14 mm body fits the enclosure. The 5.0 V I/O voltage requires compatible external logic or peripheral devices. The 16 MHz operating speed sets expectations for processing speed and interface timing, while the absence of graphics acceleration means any display or graphics function must be handled by external components. The -40°C to 85°C ambient temperature range should be checked against the final product environment, including board-level thermal effects.

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