M2GL150S-1FCG1152I
IC FPGA 574 I/O 1152FCBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 1152-BBGA, FCBGA
- 庫存
- 1,280 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Microsemi Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Obsolete |
| Series | IGLOO2 |
| Supplier Device Package | 1152-FCBGA (35x35) |
| Voltage - Supply | 1.14V ~ 2.625V |
| 資料表 | 查看資料表PDF |
採購概覽
M2GL150S-1FCG1152I 的主要供貨及採購資訊。
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M2GL150S-1FCG1152I 詳細描述
Product Overview
The Microsemi Corporation M2GL150S-1FCG1152I is an IGLOO2 field programmable gate array (FPGA) for embedded logic designs. It provides 146,124 logic elements/cells, 5,120,000 total RAM bits, and 574 I/O pins. The device operates from a supply voltage range of 1.14 V to 2.625 V and is specified for a junction temperature range of -40°C to 100°C. It uses a surface mount 1152-BBGA, FCBGA package, with a 1152-FCBGA (35x35) package designation. The device combines programmable logic, embedded RAM bits, and I/O resources in a single FPGA.
Key Features
- 146,124 logic elements/cells.
- 5,120,000 total RAM bits.
- 574 I/O.
- 1.14 V to 2.625 V supply voltage range.
- -40°C to 100°C operating junction temperature range.
- Surface mount 1152-BBGA, FCBGA package; 1152-FCBGA (35x35).
Applications
- Embedded control logic and configurable state machines.
- I/O interface and signal routing.
- On-chip memory structures using total RAM bits.
- Data-path processing in configurable logic designs.
Design & Procurement Notes
When selecting the M2GL150S-1FCG1152I, account for the 1152-BBGA, FCBGA package and 35x35 package designation during PCB layout, routing, and assembly planning. The 574 I/O count and 146,124 logic elements/cells should be mapped against required interface count and logic complexity. The 5,120,000 total RAM bits can be allocated for on-chip storage or data buffering, subject to device resources. Board power design must accommodate the 1.14 V to 2.625 V supply range, and thermal design should verify that junction temperature remains within -40°C to 100°C under expected operating conditions. The surface mount package requires appropriate PCB mounting and inspection planning.
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