M2GL100T-1FC1152I
IC FPGA 574 I/O 1152FCBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 1152-BBGA, FCBGA
- 庫存
- 1,399 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Microsemi Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Product status | Obsolete |
| Series | IGLOO2 |
| Supplier Device Package | 1152-FCBGA (35x35) |
| Voltage - Supply | 1.14V ~ 2.625V |
| 資料表 | 查看資料表PDF |
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M2GL100T-1FC1152I 的主要供貨及採購資訊。
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M2GL100T-1FC1152I 詳細描述
Product Overview
The Microsemi Corporation M2GL100T-1FC1152I is an IGLOO2 field programmable gate array (FPGA) integrated circuit for programmable logic use in embedded systems. It is packaged in a surface mount 1152-FCBGA package (35 x 35) and provides 574 input/output signals for connection to external logic, memory, and peripheral devices. The device contains 99,512 logic elements or cells and 3,637,248 total RAM bits, providing a configurable fabric for digital control, data routing, and custom logic functions. Its supply voltage range is 1.14 V to 2.625 V, and its operating junction temperature range is -40°C to 100°C, supporting use within defined electrical and thermal boundaries.
Key Features
- IGLOO2 FPGA integrated circuit from Microsemi Corporation.
- 574 I/O signals for external system connections.
- 99,512 logic elements or cells.
- 3,637,248 total RAM bits.
- 1.14 V to 2.625 V supply voltage range.
- Operating junction temperature range of -40°C to 100°C.
- Surface mount 1152-FCBGA package (35 x 35).
Applications
- Programmable logic control in equipment subsystems that require custom digital behavior.
- Board-level data routing and temporary storage using FPGA logic and RAM bits.
- Interface logic between external digital components using 574 I/O signals.
- Control functions operating within a -40°C to 100°C junction temperature envelope.
Design & Procurement Notes
Designers should account for the 1152-FCBGA surface mount package (35 x 35) and 574 I/O signals when planning PCB layout, component placement, and external connectivity. The 1.14 V to 2.625 V supply range should be included in power architecture and decoupling planning, while the -40°C to 100°C junction temperature range should be considered for thermal design and operating conditions. The 99,512 logic elements or cells and 3,637,248 total RAM bits should be compared against the logic, state machine, and memory requirements of the target design. Because the device is a field programmable gate array, resource utilization, pin assignment, and package thermal behavior should be evaluated before finalizing the board.
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