LCMXO256C-4MN100C
IC FPGA 78 I/O 100CSBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 100-LFBGA, CSPBGA
- 庫存
- 1,331 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Lattice Semiconductor Corporation |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | MachXO |
| Supplier Device Package | 100-CSBGA (8x8) |
| Voltage - Supply | 1.71V ~ 3.465V |
| 資料表 | 查看資料表PDF |
採購概覽
LCMXO256C-4MN100C 的主要供貨及採購資訊。
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LCMXO256C-4MN100C 詳細描述
Product Overview
The Lattice Semiconductor Corporation LCMXO256C-4MN100C is a MachXO series field programmable gate array (FPGA) intended for embedded digital logic designs. It provides 256 logic elements/cells, 32 LABs/CLBs, and 78 I/O in a surface-mount 100-LFBGA, CSPBGA package; the device package is 100-CSBGA (8x8). The device operates from a 1.71V to 3.465V supply and is specified for a 0°C to 85°C (TJ) junction temperature range.
Key Features
- MachXO series FPGA architecture with 256 logic elements/cells and 32 LABs/CLBs.
- 78 I/O for embedded logic, control, and interface tasks.
- Supply voltage range of 1.71V to 3.465V.
- Surface-mount 100-LFBGA, CSPBGA package with 100-CSBGA (8x8) device package.
- Operating temperature range of 0°C to 85°C (TJ).
Applications
- Embedded control logic where custom digital functions must be implemented alongside a processor or microcontroller.
- I/O expansion and glue logic between peripheral devices and logic functions.
- Sensor aggregation, timing generation, and state-machine control in compact board designs.
Design & Procurement Notes
Design considerations should include fitting the target logic into 256 logic elements/cells and 32 LABs/CLBs, while reserving enough of the 78 I/O for external connections. The 1.71V to 3.465V supply range requires a compatible regulated power rail and decoupling. Because the package is a surface-mount 100-LFBGA, CSPBGA package with 100-CSBGA (8x8) device package, PCB land patterns, stencil openings, and thermal relief should be prepared for BGA assembly. The 0°C to 85°C (TJ) operating range should be checked against worst-case junction temperature in the final enclosure, not only ambient temperature.
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